Synthesis of New Vapor-Depositable Low Dielectric Material for Interconnect and Packaged Electronics Applications

Study of gas phase reaction during vapor deposition of polymeric materials such as Parylene. Thermal stability of these polymeric films are studied using thermal desorption and nuclear reaction depth profiling techniques. Deposition of porous or gas-filled polymeric materials are fabricated for high speed interconnect applications. Structural and electrical properties of these films are characterized.