James Jian-Qiang Lü

Associate Professor

Department of Electrical, Computer, and Systems Engineering (ECSE);

Center for Integrated Electronics (CIE);
Focus Center - New York, Rensselaer: Interconnections for Hyper-Integration (FC-NY);
Center for Future Energy Systems (CFES);
New York State Center for Automation Technologies and Systems (CATS)

Rensselaer Polytechnic Institute (RPI) 

 

James Lu

Associate Professor 

Depts.: ECSE, CIE, FC-NY, CFES, CATS



Ph.D.: Technical University of Munich, Germany, December 1995

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Career Highlights:

 

Dr. James Lu is currently an associate professor in ECSE.  He is a faculty member of the Center for Integrated Electronics (CIE); the Focus Center – New York (FC-NY), Rensselaer: Interconnections for Hyper-Integration; the New York State Center for Automation Technologies and Systems (CATS); and Center for Future Energy Systems (CFES). Prior to his positions at Rensselaer, Lu worked as a research associate at the University of Virginia (UVA) in Charlottesville, VA. for a year. While a research scientist at the Technical University of Munich (TU-Munich), he was a Siemens Scholar for three years and a scholar of the German Academic Exchange Program (Deutscher Akademischer Austausch Dienst, or DAAD) for two years.   

 

Dr. Lu authored and co-authored more than 170 publications in journals, conferences or books. He served as conference, workshop and session chair and committee members of international conferences (such as Technical Chair of IMAPS 3rd International Conference on Device Packaging). He has been a panelist, panel moderator, keynote or invited speaker for many conferences, and given many seminars at government labs, universities and industrial organizations. He has served as a reviewer for a number of journals, such as the Institute of Electrical and Electronics Engineers (IEEE) Transactions on Electron Devices; IEEE Electron Device Letters;  Applied Physics Letters; Electronics Letters; IEEE Transactions on Semiconductor Manufacturing; IEEE Journal of Solid-State Circuits; Journal of Applied Physics; Solid-State Electronics, J. of Vacuum Science & Technology, etc. He is listed in the special Millennium Edition of Marquis Who's Who in Science and Engineering, received many honorable awards, including “School of Engineering Research Excellence Award”, Rensselaer, Troy, NY, 2005, and 2008 IEEE CPMT Exceptional Technical Achievement Award at the international 2008 IEEE Electronic Components and Technology Conference (ECTC) on May 29, 2008,  in Lake Buena Vista, Fla.

 

Dr. Lu is a Senior Member of IEEE and is involved in the organization’s Electron Devices Society (EDS) and its Components, Packaging, and Manufacturing Technology Society (CPMTS). He also is a member of the American Physical Society (APS), Materials Research Society (MRS), Electrochemical Society (ECS) and the International Society of Electrochemistry (ISE), National Technical Committee (3D Chair) for International Microelectronics and Packaging Society (IMAPS).

 

Lu’s Research News (30+):

  


 

Research Areas:

 

General Research Interests:

 

Lu’s research interests are in the field of micro- nano-electronics technology from theory and design to materials, devices, processing, and system integration; particularly in wafer-level 3D hyper-integration technology and micro-nano-bio interfaces for future chips, novel electron devices, interconnect technology, micro-system integration technology for micro-electrical-mechanical systems (MEMS); with long-term research interests in photonics, nanotech, bio-MEMS, bio-engineering, bio-inspired materials/devices and information processing/computation, and combination (3D integration) of nano/bio with CMOS based technologies.       

 

Text Box: Wafer bonding for 3D Hyper-Integration: Cu/oxide interconnect structures after bonding to a glass wafer and Si substrate removal by grinding, polishing and TMAH etching. (Click picture to see detail) (The hand in the photo is Professor Lu’s)
Wafer bonding for 3D Hyper-Integration: Cu/oxide interconnect structures after bonding to a glass wafer and Si substrate removal by grinding, polishing and TMAH etching. (Click picture to see detail) (The hand in the photo is Professor Lu’s)

 

Dr. Lu's wafer-level 3D hyper-integration research programs have been supported by Microelectronics Advanced Research Corporation (MARCO), the Defense Advanced Research Projects Agency (DARPA), National Science Foundation (NSF), New York State (NYSTAR), Semiconductor Research Corporation (SRC), and industries, and in collaborations with university colleagues, R&D institutions and industry partners.  He and his colleagues have developed a 3D integration technology platform for future ICs with high performance and functionality and low cost, and for low-cost Micro/Nano/Electro-Opto/Bio heterogeneous system integrations. He has worked in a broad range of fields, such as GaAs devices, GaN high power devices, Si bipolar device, terahertz electronics, interconnects in Si IC, advanced packaging, and high Tc superconductors. 

  

   
http://www.rpi.edu/~luj/index_files/image006.gif

A Vision of Future

3D Hyper-Integration

of

InfoTech, NanoTech and BioTech

systems,

by
vertically stacking

and

interconnecting

heterogeneous

materials, technologies & functions, 

to enable

extremely high functionality

-
A New Paradigm

for Future Technologies
 

SEM Image of Densified Carbon-Nanotube (CNT) Bundle Array 

for Applications, such as Interconnects (Taken by Michael Liu)

   


 

Courses:

 

 

Selected Publications:

 

Recent chapters in the following books:

"Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits,” Volume 1 and 2,  Eds. P. Garrou, C. Bower, and P. Ramm, pp. 249-259, pp. 447-462, Wiley-VCN, 2008, ISBN: 978-3-527-32034-9.


“Wafer Level 3-D ICs Process Technology,” Eds. C. S. Tan, R. Gutmann, and R. Reif, Springer, 2008,  ISBN: 978-0-387-76532-7. 


“Circuits at Nanoscale: Communications, Imaging and Sensing”, Ed: K. Iniewski, pp. 39-52, CRC Press,  2008, ISBN-13: 978-1420070620.


“Microelectronic Applications of Chemical Mechanical Planarization”, Eds. Y. Li, pp. 431-465, John Wiley & Sons, Inc., 2007, ISBN: 978-0-471-71919-9. 


“Materials for Information Technology: Devices, Interconnects and Packaging”, Eds. E. Zschech, C. Whelan, T. Mikolajick, pp. 386 – 397, Springer-Verlag (London) Ltd, August 2005. ISBN: 1-85233-941-1.


J.-Q. Lu, K. Rose, and S. Vitkavage, “3D Integration: Why, What, Who, When?”, Future Fab International, Vol. 23, July 2007. (PDF file, or http://www.future-fab.com/documents.asp?d_ID=4396#)

James Jian-Qiang Lu and Ronald Gutmann, Thorsten Matthias and Paul Lindner, "Aligned Wafer Bonding for 3-D Interconnect", Semiconductor International, 8/1/2005. (http://www.reed-electronics.com/semiconductor/article/CA630263?industryid=3032&nid=2012)

F. Niklaus, G. Stemme, J.-Q. Lu, and R. Gutmann, “Adhesive Wafer Bonding”, Applied Physics Review – Focused Review, Journal of Applied Physics, Vol. 99, 031101 (2006), Issue 3, pp. 031101-1-28, Feb. 1, 2006.

J.-Q. Lu, A. Jindal, Y. Kwon, J.J. McMahon, M. Rasco, R. Augur, T.S. Cale, and R.J. Gutmann, “Evaluation Procedures for Wafer Bonding and Thinning of Interconnect Test Structures for 3D ICs,” in 2003 IEEE International Interconnect Technology Conference (IITC), 74-76, San Francisco, (June 2003).

T. Huang, J.-Q. Lu, D. Popa, B.H. Kang, “BCB Wafer Bonding Compatible with Bulk Micro Machining,” in International Electronic Packaging Technical Conference (InterPack2003), Hawaii, (July 2003).

J.-Q. Lu, A. Jindal, Y. Kwon, J.J. McMahon, K.-W. Lee, R.P. Kraft, B. Altemus, D. Cheng, E. Eisenbraun, T.S. Cale, and R.J. Gutmann, “3D System-on-a-Chip using Dielectric Glue Bonding and Cu Damascene Inter-Wafer Interconnects,” in International Symposium on Thin Film Materials, Processes, and Reliability at the 203rd Meeting of The Electrochemical Society, Inc., Paris, (2003).

J.-Q. Lu, K.W. Lee, Y. Kwon, G. Rajagopalan, J.J. McMahon, B. Altemus, M. Gupta, E. Eisenbraun, B. Xu, A. Jindal, R.P. Kraft, J.F. McDonald, J. Castracane, T.S. Cale, A. Kaloyeros, and R.J. Gutmann, "Processing of Inter-Wafer Vertical Interconnects in 3D ICs," in Advanced Metallization Conference 2002 (AMC 2002), v18, 45-51, Eds. B.M. Melnick, T.S. Cale, S. Zaima, and T. Ohta, The Materials Research Society, (2002).

J.-Q. Lu, A. Kumar, Y. Kwon, E.T. Eisenbraun, R.P. Kraft, J.F. McDonald, R.J. Gutmann, T.S. Cale. P. Belemjain, O. Erdogan, J. Castracane, and A.E. Kaloyeros, “3-D Integration Using Wafer Bonding,” in Advanced Metallization Conference 2000 (AMC 2000), v16, 515-521, Eds. D. Edelstein, G. Dixit, Y. Yasuda and T. Ohba, The Materials Research Society, (2001).

J.-Q. Lü,  M.S. Shur,  J.L. Hesler, L. Sun, and R. Weikle, "Terahertz Detector Utilizing Two-Dimensional Electronic Fluid," IEEE Electron Device Letters, 19, (10), 373-375, (1998).

J.-Q. Lü,  M.S. Shur, J.L. Hesler, L. Sun, and R. Weikle, "A Resonant Terahertz Detector Utilizing a High Electron Mobility Transistor,” Digest of 1998 IEEE International Electron Devices Meeting (IEDM'98), 453-456, (December 1998).

J.-Q. Lü, M.J. Hurt, W.C.B. Peatman, and M.S. Shur, "Heterodimensional Field Effect Transistors For Ultra Low Power Applications," in Proceedings of 1998 IEEE GaAs IC Symposium, Atlanta, GA, 187-190, (November 1998).

J.-Q. Lü and F. Koch "Random Telegraph Noise in Advanced Self-Aligned Bipolar Transistors," in Japanese Journal of Applied Physics, 35, (1), 2B, 826-832, (1996).

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James Lu

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Rensselaer Polytechnic Institute
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Tel: (518) 276-2909


 

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