Physical Metallurgy & Computational Microstructure Lab Daniel J. Lewis Assistant Professor Department of Materials Science and Engineering Rensselaer Polytechnic Institute, Troy NY 12180 Phone: 518-276-2297 | Fax: 518-276-8554 | Email: lewisd2@rpi.edu Office: Materials Research Center, Room 110

Research Interests

• Phase transformations
• Solid-oxide fuel-cells
• Microstructure simulation and prediction using phase-field techniques
• Dendritic solidification and eutectic solidification in binary and ternary alloys
• Phase equilibria and interdiffusion in metallic, ceramic, and electrochemical systems
• Wetting behavior and meniscus geometry

Ongoing Research Projects

• Interfaces in good glass forming metals
• Determination of eutectic temperatures Cr-Hf-Si
• Structure of Ag-Cu-Sn eutectic alloys
• High temperature coatings for SOFC interconnects
• Joining of metallic foams to bulk materials for biomedical implants
• Distribution of impurities in weldments
• Transport in fuel-cell and electrochemical devices

Undergraduate Research Projects

Undergraduate research projects are always available for credit.  You will be assigned a lab book and your grade will depend on the quality and content of your lab notes and discussion of results.  Current student projects (as of Fall 2008) include:

• Studies of ceramic-matrix composite interconnects for SOFC
• Design and construction of a directional solidification system
• Thermodynamic calculations for electrochemistry and gas phase equilibria for SOFC
• Synthesis of cathode materials for SOFC
• Diffusion-convection modeling for solidification studies

Courses Taught

• Spring 2006, ENGR-1600, Introduction to Materials Science for Engineers
• Fall 2006, ENGR-1600, Introduction to Materials Science for Engineers
• Spring 2007, MTLE-6963, Advanced Kinetics
• Fall 2007, MTLE-6080, Introduction to Electron Microscopy
• Spring, 2008, MTLE-6963, Advanced Kinetics
• Fall 2008, MTLE-6080, Introduction to Electron Microscopy

List of answers to ENGR-1600 quizzes.

Office Hours and Advising

Monday, 9:00-11:00 or by appointment.  If you choose to make an appointment, please send multiple times when you can meet.  Monday is my research meeting day.  If you arrive outside of office hours, please expect to wait for a short time while I finish the weekly research meetings.

First Year Advisees can find the presentations from our meetings here.

More Information on Research Topics

Droplets wetting heterogeneous surfaces.

Cr-Si-Hf, Nb-Si-Ti phase equilibria

The Double Bubble Problem.  How is this related to Ostwald ripening?

Allen-Cahn kinetics and phase field modeling.

Eutectic microstructures.

Transitional and eutectic reactions in metallic systems.

Solder alloy systems studied previously:  Ag-Cu-Sn, Ag-Sn, Cu-Sn, Sn-Pb, Bi-Pb, Au-Pb-Sn, Bi-Pb-Sn

PICS Research Group Information

The local research pages and wiki for those on campus.

Publications (Outdated)

• D. Chatain, D. Lewis, J.-P. Baland, and C. Carter, ”Numerical Analysis of the Shapes and Energies of Droplets on Micropatterned Substrates,” Langmuir, 22(9), p. 4237-4243 (2006)
• A. Zribi, L. Iorio, and D. Lewis, ”Oil-Free Stress Impedance Pressure Sensor for Harsh Environment,” Proceedings of the 4th IEEE Conference on Sensors (2005)
• R. Schaefer and D. Lewis, “Directional Solidification of an Ag-Cu-Sn Ternary Eutectic,” Metallurgical and Materials Transactions A, 36A(10), p. 2775-2783 (2005)
• S. Allen, M. Notis, R. Chromik, R. Vinci, D. Lewis, R. Schaefer, “Microstructural evolution in lead-free solder al loys: Part II. Directionally solidified eutectic Sn-Ag-Cu, Sn-Cu and Sn-Ag alloys,” Journal of Materials Research, 19(5), p. 1425-1431 (2004)
• D. Lewis, T. Pusztai, L. Granasy, J. Warren, W. Boettinger, “Phase Field Models of Eutectic Solidification” JOM, April 2004, p. 35-39
• D. Lewis, W. Bottinger, J. Warren, “Three Dimensional Phase Field Modeling of Binary Eutectics,” Modeling of Casting, Welding and Advanced Solidification Processes X, TMS, Warrendale, PA (2003)
• D. Lewis, S. Allen, M. Notis and A. Scotch, “Determination of the Eutectic Structure in the Ag-Cu-Sn System,” Journal of Electronic Materials, 31(2), p. 161-167 (2002)
• D. Lewis, D. Gupta, and M. Notis, “Diffusion of Ag Isotope in PZT Ceramic,” Defect and Diffusion Forum, 194-199, p. 1009-1016 (2001)
• D. Lewis, D. Gupta, M. Notis, and Y. Imanaka, “Diffusion of 110Ag Tracer in Polycrystal line and Single Crystal Pb Containing Piezoelectric Ceramics,” Journal of the American Ceramic Society, 84(8), p. 1777-84 (2001)
• D. Lewis and S. Allen, “Ag-Cu-Sn Ternary Eutectic Structure Determination,” Advanced Materials and Processes, February 2001, 42-43.
• D. Lewis, M. Notis, and A. Grusd, “Phase Equilibria and Thermal Analysis Near the AuPbSn Eutecitc,” Journal of Phase Equilibria, October 2000, 425-431.
• D. Lewis, J. Warren, and D. Josell, “A New Solder Joint Design Tool for IC Package Designers,” Proceedings of the 48th Annual ECTC, Seattle, WA, 1998, 734-736.

Last updated: September 8, 2008