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May 29, 2001

Extending the Horizons of Copper Interconnect Technology

 

Researchers at Rensselaer have discovered a clever new use for ultra-thin molecular structures that could make computers and other microelectronic devices faster and more efficient. This advance could extend copper technology by allowing smaller and more reliable interconnect structures with more than twice the interconnect speed than otherwise be possible.

     
 

Troy Building Window Honors Lallys' Most Recent Support

Hold the Date: Architects Make Final Presentations
June 14

 

Robert Baron Named Interim Dean of Lally School

  Funk-E
  Jacob Fish Elected Fellow of USACM
  What's New in Business? A Man/Machine System

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