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Nalamasu Honored by the American Chemical Society
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| Photo: Paul Castle |
Omkaram “Om” Nalamasu, director of the Center for Integrated Electronics, has been selected to receive the Roy W. Tess Award in Coatings for 2004 from the American Chemical Society’s Division of Polymeric Materials: Science and Engineering (PMSE). The award is presented annually in recognition of outstanding contributions to coatings science and technology.
In announcing the award this week, PMSE noted that Nalamasu’s pioneering contributions to the optical lithography and photoresist materials have played a major role in enabling the microelectronics revolution.
Nalamasu is recognized as one of the world’s leading experts in the areas of optical lithography and photoresist materials science and technology. He developed key concepts related to the Chemically Amplified Photoresist (CAMP) process and novel resist materials and processes. Nalamasu applied his research to the implementation of both 248 nm (nanometer) and 193 nm (nanometer) photoresist technologies. Applications for his work include computer chip fabrication.
“Professor Nalamasu is a recognized leader in microelectronics and nanoelectronics. His work is fundamental for next-generation computing and communication devices. His vision and strategic direction are taking Rensselaer’s program to new heights,” said Arthur Sanderson, vice president of research at Rensselaer. “Professor Nalamasu has a track record of excellence. The Tess Award is yet another affirmation of his extraordinary work.”
In 2003, Nalamasu received the NYSTAR Distinguished Professor Award consisting of a $1 million research grant. In 2000, he earned the American Chemical Society National Award for Team Innovation for the Invention and Innovation of 193 nm (nanometer) Resist Material. In 1998 he was a recipient of Japan's Photopolymer Science & Technology Award and was an invited speaker at the National Academy of Engineering's symposium on the “Frontiers of Engineering.” Additionally, in 1997 he and his technical team won an R&D 100 Award for Invention, Development and Commercialization of the first Deep-UV (ultraviolet) Chemically Amplified Photoresist (CAMP), which refers to the use of 248 nm wavelength light to pattern small features.
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