Along with nanoscale and high heat situations, Ramanath is confident the new nanoglue will have other unforeseen uses.
Plus, the molecular glue is inexpensive 100 grams cost about $35 and already commercially available. The method of creating the nanoglue can definitely be scaled up to meet the low-cost demands of a large manufacturer.”
Ramanath and his team have filed a disclosure on their findings and are moving forward toward a patent, which will complement the robust portfolio of other intellectual property they hold in this field. The team is also exploring what happens when certain variables of the nanoglue are tweaked, such as making taller nanolayers or sandwiching the layers between substances other than copper and silica.
Along with Ramanath, Rensselaer materials science and engineering graduate students Darshan Gandhi and Amit Singh contributed to the paper. Other co-authors include Rensselaer physics professor Saroj Nayak and graduate student Yu Zhou, IBM researcher Michael Lane at the T.J. Watson Research Center in Yorktown Heights, N.Y., and Ulrike Tisch and Moshe Eizenberg of the Technion-Israel Institute of Technology.
Ramanath’s ongoing research is supported by the National Science Foundation, the U.S.-Israel Binational Science Foundation, the Alexander von Humboldt Foundation, and New York state through the Interconnect Focus Center.