Advanced Device Processing
Materials Science and Engineering - MTLE-6960

Description
The main theme of the course is the patterning of thin films for device processing. The course is divided into two parts: micro-lithography and dry etching. The first part will describe in detail optical, e-beam, and x-ray lithography with the associated resist technologies. The second part will present an introduction to plasmas and discharge followed by a discussion of modern etch techniques for fine line patterning.

Prerequisites
Background in semiconductor materials and processes.

Textbook(s)
Ordering Information

Format
Classes: 28 sessions
Homework: 7
Project/Paper: 1
Exams: 2

Grading
Homework: 15%
Term Project: 25%
Exams: 60%

Computing
Email and World Wide Web access required for course communications, use of WebCT, and printing of course notes.

Access to WebCT, Rensselaer's course management tool, is required. Please refer to this page for instructions on how to set up your computer for WebCT.

Who Should Enroll
This course may be used in your Plan of Study as follows:

Degree Programs
CSCI - elective with advisor pre-approval
CSYS - technical elective
ELEC - technical elective
EPOW - technical elective
ESCI-MOT - elective with advisor pre-approval
ESCI-MSE - manufacturing design elective
ITEC - n/a
MANE - elective with advisor pre-approval
MBA - elective with advisor pre-approval
MGMT-MS - elective with advisor pre-approval
MGTE - elective with advisor pre-approval
TCOM - n/a

This course is also open to non-matriculated students who meet the prerequisites and may be used toward the Certificate in Microelectronics Manufacturing Engineering.

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