Micro and Nano Fabrication Clean Room
Processes
The Micro and Nano Fabrication Clean Room supports a variety of silicon and compound semiconductor processes.
The processes that are supported include, but are not limited to:
High Temperature:
PECVD
Diffusion
RTA
RCA
Metallization and BEOL:
E Beam
Sputtering
Wafer Alignment/Bonding
CMP
Measurement:
Thin Film
Microscopy
Electrical Test
Photolithography :
Spin Coaters
Steppers
Aligners
Developers
Nanolithography:
Crossbeam FIB/SEM
Direct Write E-Beam
Dip Pen Nanolithography
Etch:
Dry Etch
Wet Etch
MNCR Staff
Clean Room
Manager
David King
(518)-276-2938
kingdc@rpi.edu
Senior Applications
Engineer
David Frey
(518)-276-3323
freym2@rpi.edu
Process
Engineer
Bryant Colwill
(518)-276-3946
colwib2@rpi.edu
Equipment
Engineer
John Barthel
(518)- 276-2975
barthj@rpi.edu
Equipment
Engineer
Kent Way
(518)- 276-3317
wayk2@rpi.edu