Micro and Nano Fabrication Clean Room











Processes




Semitherm LPCVD System



The Micro and Nano Fabrication Clean Room supports a variety of silicon and compound semiconductor processes.

The processes that are supported include, but are not limited to:

High Temperature:
  • PECVD
  • Diffusion
  • RTA
  • RCA


Metallization and BEOL:
  • E Beam
  • Sputtering
  • Wafer Alignment/Bonding
  • CMP


Measurement:
  • Thin Film
  • Microscopy
  • Electrical Test
Photolithography :
  • Spin Coaters
  • Steppers
  • Aligners
  • Developers
Nanolithography:
  • Crossbeam FIB/SEM
  • Direct Write E-Beam
  • Dip Pen Nanolithography
Etch:
  • Dry Etch
  • Wet Etch









MNCR Staff





Clean Room
Manager

David King
(518)-276-2938
kingdc@rpi.edu

Senior Applications
Engineer

David Frey
(518)-276-3323
freym2@rpi.edu

Process
Engineer

Bryant Colwill
(518)-276-3946
colwib2@rpi.edu


Equipment
Engineer

John Barthel
(518)- 276-2975
barthj@rpi.edu

Equipment
Engineer

Kent Way
(518)- 276-3317
wayk2@rpi.edu