Micro and Nano
Processes - High Temperature - PECVD
|For training on this equipment, contact the assigned module leads|
Etching (RIE) purposes.
13.56 MHz, Maximum Power : 555 W
Reserved Processes (Do not Reprogram these)
1. Cleaning (either of the chambers).
2. Silicon Oxide Deposition.
3. Silicon Nitride Deposition.
4. Silicon Oxide Etch..
Typical Plasma colors (Can be seen through the view ports)
Training & Usage
Please contact the module
schedule a training session. After attending the training session, you
expected to return within one week with your own sample to test in the
of the module lead. You may NOT use the equipment unsupervised until
have successfully passed the test.
& Documentation (Under Construction)