- Fill up the log book.
- Make sure that the person
who
was using the PlasmaTherm before you is done with it.
- Turn the placard
on
the machine with In
Use showing.
- Make sure that the control panel key is in the
MANUAL OPERATION position.
- Hold the MANUAL button,
together with the USE TURBO button (both LED's should be lit together for such
operations
which requires two buttons to be pressed together).
- Now the USE TURBO
light
will start blinking till the chamber has been vented and atmospheric
pressure
has been reached.
- When the USE TURBO light
stops blinking (after ~ 2mins) the
chambers
may be opened. Both the chambers are vented simultaneously.
- Wipe the inside of the chamber with texwipes using
isopropanol.
- Wipe the O-rings with texwipes, to make sure that the chamber is
airtight.
- Load samples in the chamber that you desire to
use.
- With chamber selection key (top of figure 2), choose the correct
chamber.
- Close both chambers.
- Depress the MANUAL and PUMPDOWN
buttons at the same time.
- The PUMPDOWN
light will start blinking.
- Once the chamber has
been pumped
down the light stops blinking and you are ready to program.
Background
The
PlasmaTherm has 9 programmable processes. The
first
four for this unit are reserved and are listed on page 1. You can use
programs
5-9 for your processes.
In general any process
consists
of the following 7 steps.
- Pump Down step: In this step, the chamber
is
pumped
down to get rid of possible contaminant gases.
- Purge: The chamber is purged with
the reactive
gases.
This step ensures that only the reactive gases will be present during
the
reactive step.
- Pressure stabilization: The
pressure is set and
the
gases are flowed till the desired pressure is reached.
- Reaction:
The RF power is turned on. This is the
actual deposition / etching step. Here you should be able to see the
plasma.
- Pumpdown: Now that you are done
with the
deposition/
etching, the reactive gases with byproducts are pumped out. Note:
You should open the chamber only after all the 7 steps are completed,
specifically after step 5-7 (especially after you abort the run).
- Nitrogen
Purge: Chamber is purged with
nitrogen
to flush out the gases.
- Pumpdown: This nitrogen
(with some residual
gases)
is pumped out.
Each
of the above steps involves programming the step
time,
gas flow rates, pressure and the rf power. The values that are
programmed
in are listed out in the recipe sheets.
Programming
- Turn
control panel key to CHANGE STORED
PARAMETERS.
- Choose process no. (Example : To
choose
process
5, press PROCESS and 5
together.)
- Start with step: Press STEP and 1
together.
- Set
desired parameter from the recipe
sheet.
(Example: To set pressure for step 1 to 0, press SET and PRES. This will
cause
all the numbers of the control panel to light up. Now enter 0 and then
press
STEP(ENTER) again. Now the all the lights of the number pad will
go off
and
the value has been set.
- Repeat
for all other parameters and then
for
all the steps.
- Select the appropriate
gases
using the switches shown in figure 2 as some of the gas lines are
hooked
up to more than one gas. If you are using CHF3, the valve
needs
to be turned on and is located in the service bay behind the
PlasmaTherm.
After you are done close the valve. Be
careful when you go
into
the service bay. The floor is slippery because of oil from the pump.
- If your deposition is
to
be done above room temperature then START
the heater (again a toggle
switch).
The temperature indicator and control is on the lower left of the
PlasmaTherm.
Pressing the knob and then turning it sets the temperature. It
typically
takes 1 hour for the deposition chamber to heat up to 300oC.
- Turn the control panel
key
to MANUAL OPERATION. Select
your process, choose step 1 and press RUN.
(Example:
For running process 6, press PROCESS
together with 6, then STEP
together
with 1 (to make sure that the process starts with step 1), then press RUN.
- To pause the process, just hit STOP
once.
- To abort the process and reset to the beginning,
hold
STOP for around 5 seconds
(till beeping stops). Whenever you abort the
process
and want to open the chamber do a manual nitrogen purge before opening.
- Manual Nitrogen Purge:
- Press MANUAL and GAS 3
together.
GAS 3 light should turn
on.
- Now press SET and GAS 3 together, now number pad
will
be lit.
- Punch in 30 and then press
STEP/ENTER. This will set a 30% (of
maximum
flow) of N2.
- Let the nitrogen flow for 2 minutes.
- Press
MANUAL
and GAS 3 together again. The
GAS 3 light should go off.
- Now do the
vent
sequence to open the chamber.
Note: Make sure
that
the gases are flowing. (Example: To check the flow rate of gas 4. When
you
are in step 2, press READ and GAS 4). This value is usually a bit
different
from what was programmed. If this value is very low then press the GAS
DEMAND
switch (figure 2). If flow rate is still low then abort the process and
talk
to John about it.
Parameters like
pressure
and gas flow rates can be set manually.
- For this the control panel key
should
be in the MANUAL OPERATION
mode.
- Now if you want to set gas 2 flow rate
to
50% then you would first activate gas 2 by pressing MANUAL and GAS 2
together.
This causes the GAS 2 LED to
light up.
- Now the flow rate can be set by
pressing
SET and GAS 2 together which would cause the
data entry pad to light
up.
- As in the programming section you would enter the value and then
press
ENTER.
- Once you have set
the desired gas flow rates and the pressures you can turn on the rf
power.
With the current rf unit the is turned on by setting the desired power
using
the
dial control and then throwing up the rf on switch.
- When the process has
run for the desired time (that you are monitoring) first turn off the
rf
then deactivate pressure control (this can be done by pressing MANUAL
and
PRESSURE together again)
and then deactivate the gas flow controls.
You
should in general
following the step by step procedure giving in the recipes (i.e. turn
on
gases, set
pressure,
turn on rf ,
switch off rf,
turn off pressure control, turn off gases, turn on nitrogen, purge with nitrogen for 3-4 mins, turn off
nitrogen.
Same
as done in the beginning. Take out your
samples.
- Do the pump down as described earlier.
- The chamber
has
to be cleaned using a plasma based cleaning recipe. Process 1 has been
programmed
to do a 60 min clean using CF4. (for the deposition chamber
make
sure that CF4 is selected using the selector knob).
- Now run
Process
1. Make sure that gas is flowing (described in Running the
Process),
logout and now you may leave.
In
case of emergency, hit the big red EMO button
on
the left side of the Plasma-Therm. This will switch off the hazardous
gases
and the power to the machine.
- Make
sure that the valves of the relevant
cylinders
are open. All the gas cylinders (except oxygen & silane) are behind
the
plasmatherm in the maintenance bay.
- Press the green gas demand button shown in
figure
2 in the instructions.
This happens
when
the rf unit is overheated. Run your process with lower power setting or
do
it in multiple runs.
- If the hold light is lit, this has
happened
because
the process had been paused in the middle of the run.
- Press the stop
button
for 5 seconds till beeping stops.
Note:
hitting the stop button once merely
pauses
the process. To restart the process you have to hold the stop button
for
around 5 seconds till beeping stops.
This
happens when the shower head is dirty. Do a
plasma clean + wipe till the shower head looks clean.
When
this happens press MANUAL + PUMPDOWN
again.