TOOL STARTUP

The CMP tool remains idle for most of it's life. The idle state has no pad on the platen, no slurry in the slurry lines, and no water flowing to the tool. To begin processing, we must prepare the tool, flush the lines, and turn on the water.

(1) Turn water on in gray area behind tool. Black valve handle should be in the vertical position to be ON

(2) Power should already be on -- tool power should never be turned off after polishing * If power is not on, press green POWER ON button next to screen

• Tool will power up, and request a password. Password is "333". Type and hit ENTER.
• Tool will continue to power up, and will initialize all stations (arm, load, unload)

(3) Open front plastic guard, and pull out small metal inter-lock LS 11 to stop error message

(4) Open right side plastic guard; lift and rest on wet bench knob. Pull out metal inter-lock LS 12 to stop error message

(5) Put pad on platen

• Select Screen/Move Arm/Primary Polish
• Use wrench to remove slurry dispense wand (this avoids bending and breakage during pad placement)
• Select Screen/Manual Operations/Carrier Park (this moves head back out of the way so that pad can be placed)
• Place pad, making sure that pad is centered. Start with far side, and work your way towards your body, attaching the pad a bit at a time to reduce air bubbles

(6) Wet pad thoroughly with DI water gun

(7) Prime slurry line

• Choose proper slurry line for your CMP application (line 1 for oxide, line 2 for metal/experimental slurries)
• Place slurry line in DI water jug
• Select Screen/Polish Control/Slurry #_ Test
• choose a flow rate (250 - 500 ml/min) to get water pumping through the line
• make flow rate zero when pad is adequately wet, and slurry line runs clear with water.

(8) Load recipe

• Select Screen/Process Management -- select the proper recipe