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Processes - Photolithography - Spin Coaters - FlexiFab 200mm Wafer Spinner

For training on this equipment, contact the assigned module leads

FlexiFab 200mm Wafer Spinner for BCB

Links

Solitec Wafer Processing, Inc.
(Manufacturer's Web Site)







General Information

Coat Module

FlexiFab's self-contained Coat Module provides unparalleled process performance and control in photoresist applications. When all of the features inherent to the FlexiFab Coat Module are merged together, they give the process engineer the freedom and ability to achieve and maintain repeatable process results.

Dedicated to coating processes, FlexiFab's Coat Module retains its reliability in whatever system configuration your process requires. The Coat Module employs a dynamic dispense arm, versatile spin motor, and aerodynamic process bowl; coupled with a reliable mass flow exhaust controller to ensure the process engineer complete process control.

Standard Features

  • Teflon® Process Bowl
  • Delrin® Chuck
  • Encoded Dispense Arm
  • Programmable Predispense
  • Programmable Backside Rinse
  • Programmable Process Cup Rinse
  • Backside Edgebead Removal
  • Topside Edgebead Removal
  • 360º Symetric Exhaust
  • Exhaust Controller
  • Circumferential Centering Device
  • Delrin Centering Tips
  • DC Brushless Spin Motor
  • Optical Encoder
  • Digital rpm Control
  • Clockwise/Counterclockwise Capability
  • Water-Jacketed Motor
  • On-Board Microprocessor

Hot Plate Module

Standard Features

  • Nickelized Copper Plate with Titanium Nitride Surface
  • Stepper-Motor Lift Pins
  • Contact Bake
  • Vacuum Pull-Down
  • Multiple Proximity Bake Positions
  • Programmable Bake Times
  • Programmable Pin Speed
  • RTD Temperature sensor
  • Nickelized Aluminum Funnel
  • 360º Symmetric Exhaust
  • Safety Snap Switch
  • On-Board Microprocessor

Elevator Module

FlexiFab's self-contained Elevator Module provides unparalleled process performance and control in substrate handling and transportation. When all of the features inherent to the FlexiFab Elevator Module are merged together, they give the process engineer the freedom and ability to achieve and maintain repeatable process results.

Dedicated to safe and precise substrate handling FlexiFab's Elevator Module retains its reliability in whatever system configuration your process requires. Compatible with all SEMI-Standard cassettes, the Elevator Module may be used as a Send, Receive, or a Send/Receive unit. The reliable encoder-driven motor and programmable pitch function combine to give the process engineer complete process control.

Standard Features

  • Nylon-Coated Aluminum Cassette Platten
  • Send Module
  • Receive Module
  • Send/Receive Module
  • Encoder-Controlled Drive Motor
  • Slot-to-Slot Integrity (Send/Receive)
  • Programmable Pitch
  • On-Board Microprocessor

Buffer Module

FlexiFab's self-contained Buffer Module provides unparalleled process performance and control in substrate handling and system integration. When all of the features inherent to the FlexiFab Buffer Module are merged together, they give the process engineer the freedom and ability to achieve and maintain repeatable process results.

Dedicated to safe and precise substrate handling FlexiFab's Buffer Module retains its reliability in whatever system configuration your process requires. The Buffer Module utilizes a stepper motor driven rotational plate, 270º spin radius, and programmable pitch function to ensure the process engineer risk free substrate transport; while MTI's rugged FlexiArm™ handler drastically reduces the risk of particulate contamination.

Standard Features

  • Nylon-Coated Aluminum Cassette Platten
  • Rotational Table
  • Stepper Motor Drive
  • Low Friction Bearings
  • Opto-Sensors for Precise Positioning
  • Programmable Pitch
  • On-Board Microprocessor

Specifications

Spin Motor

  • Spin Speed Range: 10-10,000 rpm (in 10 rpm increments)
  • Spin Speed Control: 
    •  ±1rpm (from 0-1000 rpm);
    •  ±0.1% rpm; (from 1,000-10,000 rpm)
  • Acceleration Range: 250-50,000 rpm/sec; (in 250 rpm/sec increments)
  • Acceleration Control: ±0.5% of set point

Develop Uniformity (200mm wafer, 1µ, Resist Film)

  • Across Wafer:  0.04µm for 0.5µm line
  • Wafer to Wafer:  0.04µm for 0.5µm line
  • Lot to Lot:   0.04µm for 0.5µm line

Process Control Options

  • Fluid Temperature Control: 15-30ºC; ±0.25ºC
  • Programmable Exhaust:
    • 0-700 linear ft/min;
    • 0.10"- H2 O minimum;
    • Controlled to set point; Within 15 milliseconds

Centering Device

  • Accuracy:  ±0.003º (0.08mm)

Encoded Dispense Arm

  • Accuracy:  ±0.0006º (0.16mm)
  • Arm Extend Speed Range: 0.1"-9.9" per second (in 0.1" increments)


Training & Usage

Please contact the responsible module lead to schedule a training session. After attending the training session, you are expected to return within one week to test in the presence of the module lead. You may NOT use the equipment unsupervised until you have successfully passed the test.

If you do not log onto the equipment for any sixty (60) day period, you forfeit your qualification and must schedule your next session with the module lead to re-test.


Reservations

Reservations for the equipment may be made on the scheduling sheet next to the equipment, or by contacting the module lead

Procedures & Documentation

 (Under Construction)