Micro and Nano Fabrication
Clean Room



Processes - Metallization and BEOL - Sputtering - CVC #1

 For training on this equipment, contact the assigned module leads
CVC Sputterer

CVC Sputterer #1

Links (Under Construction)

General Information

The Sputterer uses an ionized gas (usually Argon, but Nitrogen can be used in some cases) to impact a target material, thereby releasing atoms of the target material into the vacuum chamber.  These target atoms then attach themselves to a process wafer, located in the vacuum chamber.  Sputtering is a process that is used when good step coverage of uneven wafer surfaces is desired.

Standard Processes

Process 1:  500 nm Aluminum Deposition

Process 2:  100 nm Tantalum Deposition followed by a 1000 nm Copper Deposition without breaking vacuum.

Above processes are used as a baseline process to qualify the sputterer following an extended maintenance period, prior to releasing the sputterer for general use. 

Use the values in the chart below to program the power supply for these processes:

Advanced Energy MDX-052 Power Supply Programming Values
Target Material
 Thickness (nm)
 Power (Kw)
 Ramp Time (min)
 Pre-Sputter Time* (min)
 Sputtering Time (min)
Aluminum
 500
 2.5
 1
 3
 10
Tantalum
 100
 1.65
 1
 3
 5
Copper
 1000
 2.3
 1
 3
 10

*NOTE:  Pre-Sputter time may be extended if target is found to be dirty

Training & Usage

Please contact the module lead to schedule a training session. After attending the training session, you are expected to return within one week with your own sample to test in the presence of the module lead. You may NOT use the equipment unsupervised until you have successfully passed the test.

If you do not log onto the CVC Sputterer for any sixty (60) day period, you forfeit your qualification and must schedule your next session with the module lead to re-test. 

Currently, the equipment is password protected. Qualified users are notified of the current password, as well as the equipment condition, via e-mail on a weekly basis

Reservations

Reservations for the equipment may be made on the scheduling sheet next to the equipment, or by contacting the module lead.

Procedures & Documentation

  1. Shutdown
  2. Startup
  3. Operating Procedures:
    1. Initial Checks
    2. Pumpdown
    3. Preparation for Sputtering
    4. Power Supply Programming
    5. Sputtering
    6. Post-Sputtering
  4. Maintenance Procedures:
    1. Cryopump Regeneration