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General Information
The Micro and Nano
Fabrication Clean Room utilizes a AG
Associates Heatpulse 610 Rapid Thermal Processor to heat
individual wafers up to 6 inches in diameter for short periods of time
(typically 1 - 600 seconds, but can be up to 9999 seconds) at precisely
controlled temperatures.
These capabilities, combined with the heating chamber's
cold-wall
design and superior heating uniformity, provide significant advantages
over conventional furnace processing. Key features include:
- Closed-loop temperature control with pyrometer or
thermocouple or thermocouple temperature sensing.
- Precise time-temperature profiler tailored to suit specific
process requirements.
- Fast heating and cooling rates unobtainable in conventional
technologies.
- Consistent wafer-to-wafer process cycle repeatability.
- Small footprint and energy efficiency
Specifications
- Steady State Temperature Range: 400 -
1200 C
- Steady State Temperature Stability: +/- 7 C
- Temperature Monitoring Mechanisms: Standard
pyrometer (used above 800 C), and a thermocouple (used below 800 C)
- Heating Rate: 1-200 C per second,
user-controllable.
- Cooling Rate: Temperature dependent; max 150
C per second
- Steady State Time: 1-9999 sec. (1-600
sec. Recommended)
Training & Usage
Please contact the module lead to
schedule a training session. After attending the training session, you
are
expected to return within one week with your own sample to test in the
presence
of the module lead. You may NOT use the equipment unsupervised until
you
have successfully passed the test.
Reservations
Reservations for the equipment may be made on the scheduling sheet next
to the equipment, or by contacting the module
lead.
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