Focus
Center, New York: Rensselaer - Task
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Major Accomplishments: 3D technology platform processes
Via-chains for via-last 3D platform demonstrated and process issues delineated, with one-micron wafer-level alignment, thermal-mechanical-electrical robust wafer bonding and thinning, and copper-damascene patterned inter-wafer interconnects; robust bonding and thinning established in collaborations with SEMATECH and Freescale
Feasibility of via-first 3D platform demonstrated that offers the bonding strength of dielectric adhesive bonding (partially cured BCB) with the process integration advantages of via-first bonding;
Low-temperature Ti-based bonding to both silicon and oxide demonstrated, attractive for various 3D applications and needs.
Novel applications and thermomechanical stress
Various innovative technologies explored for 3D interconnectivity, with 3D integration of metal nanorods, carbon nanotubes and micro-nano interface particularly attractive;
Optical beam vias with very high optical coupling with multilayer dimensions useful in forming optical 3D structures;
Thermomechanical stress modeling, indicating that micron-sized vias with small pitch and thin bonding adhesive can significantly reduce stress levels that can cause TCE-mismatch induced stress failure in Cu vias and in Ta liners.
3D-enabled designs
The memory performance predictor (PRACTICS) developed for predicting the reduction of memory access time and SRAM dynamic power dissipation, allowing a more extensive comparison of 2D and 3D designs;
Design of next-generation transceivers enabled by technology partitioning possible with 3D implementation; promising for software radios with SiGe BiCMOS ADCs;
Buck-topology, monolithic DC-DC converter designs using advanced foundry design rules, indicating the promise of the buck converter, particularly as a point-of-load converter with low conversion ratio; the performance advantage of high capacitance density capacitors and magnetic film inductors shown by extensive circuit simulations.
Major Accomplishments: University at Albany, MIT, IBM, Freescale Semiconductor, International SEMATECH, JPL, EVGroup, Motorola.
