Associate Professor of Materials Science
Rensselaer Polytechnic Institute
Ph.D., Chemical Physics, University
of Minnesota, 1974
Diploma, Physics, University of Zürich, Switzerland,
Steinbrüchel began his professional
career as a research associate at the University of California,
Berkeley, from 1974 to 1975. He then spent two years as a research
associate at the University of Chicago. In 1977, Steinbrüchel
joined the Argonne National Laboratory as an assistant scientist
for three years. He spent the following seven years in Switzerland,
first as a research physicist for RCA Laboratories, then as a group
leader for Mettler Instruments. In 1989, he joined the Rensselaer
faculty, where he currently serves as an associate professor.
The author of more than 90 scientific papers,
a book, and five book chapters and monographs, Steinbrüchel
also has served as a peer reviewer for the National Science Foundation
and several scientific journals. Among these publications are Applied
Physics Letters, Journal of Vacuum Science Technology, Journal of
The Electrochemical Society, and Thin Solid Films. The
Semiconductor Research Corporation (SRC) awarded Steinbrüchel
its Inventor Recognition Award in 1991.
Steinbrüchel's research focuses on thin film processing and
characterization for microelectronics and sensor applications. His
interests include issues arising in back-end-of-the-line processing,
especially copper interconnect technology. His specific expertise
is in the areas of plasma processes (etching, chemical vapor deposition,
and sputtering), plasma process diagnostics, process contamination
control, thin film and interface characterization, and surface analysis.
His current projects include studies on plasma
processing of low-k dielectrics, plasma diagnostics using a Langmuir
probe, and diffusion barriers between copper and low-k dielectrics.
L. Graham, Ch. Steinbrüchel, and D.J.
Duquette, "Nucleation and Growth of Electrochemically Deposited
Copper on TiN and Copper from a Cu-NH3 Bath," Journal of
The Electrochemical Society, 149, C390-C395, (2002).
A. Karamcheti, V.H.C. Watt, H.N. Al-Shareef, T.Y
Luo, M.D. Jackson, H.R. Huff, and Ch. Steinbrüchel, "Characterization
of Ultrathin Gate Dielectrics Formed by In-Situ Steam Generation
with Nitrogen Postprocessing," Journal of Electronic Materials,
31, 124-128, (2002).
H. Kizil, G. Kim, Ch. Steinbrüchel, and B.
Zhao, "TiN and TaN Diffusion Barriers in Copper Interconnect
Technology: Towards a Consistent Testing Methodology," Journal
of Electronic Materials, 30, 345-348, (2001).
G. Narasimhan and Ch. Steinbrüchel, "Analysis of Langmuir
Probe Data: Analytical Parametrization, and the Importance of the
End Effect," Journal of Vacuum Science Technology A,
19, 376-378, (2001).
Ch. Steinbrüchel and B.L. Chin, Copper
Interconnect Technology, SPIE Press: Bellingham, WA, (2001).
A. Mallikarjunan, S.P. Murarka, Ch. Steinbrüchel,
A. Kumar, and H. Bakhru, "Electrical Behavior of Cu-Thin PECVD
Fluorinated Oxide MIS Capacitors Journal of The Electrochemical
Society, 147, 3502-3507, (2000).
A. Karamcheti and Ch. Steinbrüchel, "Parametrization of
Laframboise's Results for Spherical and Cylindrical Langmuir Probes,"
Journal of Vacuum Science Technology A, 17, 3051-3056,
S.E. Kim and Ch. Steinbrüchel, "Metal/Fluorinated-Dielectric
Interactions in Microelectronic Interconnections: Rapid Diffusion
of Fluorine Through Aluminum," Applied Physics Letters,
75, 1902-1904, (1999).
Ch. Steinbrüchel, "Reactive Ion Etching,"
in Handbook of Thin Film Process Technology, C.1.1:1-C1.1:23;
eds. D.A. Glocker and S.I. Shah; IOP Publishing; Bristol, UK; (1995).
Ch. Steinbrüchel, "The Formation
of Particles in Thin Film Processing Plasmas,"
in Physics of Thin Films, 18, 289-318, eds. M.H. Francombe
and J.L. Vossen, Academic Press: San Diego, (1994).
113 Materials Research Center
Rensselaer Polytechnic Institute
110 Eighth Street
Troy, N.Y. 12180 USA
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