Jian-Qiang "James" Lü
— Associate Research Professor of Physics, Applied Physics and Astronomy; and Electrical, Computer, and Systems Engineering,
Rensselaer Polytechnic Institute

Education:
— Ph.D., Physics, Technical University of Munich, 1995
— M.S., Physics, Peking Normal University, China, 1986


Career Highlights:
Lü joined the Rensselaer faculty in 1997 as a research scientist and now serves as an associate research professor. Lü is a faculty member of the Center for Integrated Electronics (CIE); the Focus Center - New York (FC-NY), Rensselaer: Interconnections for Gigascale Integration; and the Center for Automation Technologies (CAT). Prior to his positions at Rensselaer, Lü worked as a research associate at the University of Virginia in Charlottesville for a year. While a research scientist at the Technical University of Munich, he was a Siemens Scholar for three years and a scholar of the German Academic Exchange Program (Deutscher Akademischer Austausch Dienst) for two years.

He recently served as session chair of the 19th International VLSI Multilevel Interconnection (VMIC) Conference in Singapore and has been an invited speaker for many conferences, universities, and industrial organizations. He is listed in the special Millennium Edition of Marquis Who's Who in Science and Engineering and has served as a reviewer for the Institute of Electrical and Electronics Engineers (IEEE) Transactions on Electron Devices; Applied Physics Letters; Electronics Letters; IEEE Transactions on Semiconductor Manufacturing; IEEE Journal of Solid-State Circuits; Journal of Applied Physics; and Solid-State Electronics.

Lü is a Senior Member of IEEE and is involved in the organization's Electron Devices Society (EDS) and its Components, Packaging, and Manufacturing Technology Society (CPMTS). He also is a member of the American Physical Society (APS) and the International Society of Electrochemistry (ISE).

Research Areas:
Lü's research interests are in the field of semiconductor technology including materials, devices, processing, and system integration. His current research focuses on novel electron devices, interconnect technology for gigascale integration, micro-system integration technology for microelectrical mechanical systems (MEMS), and 3-D hyper-integration.

Lü is one of the pioneers in the field of wafer-level 3-D hyper-integration. He has been leading a 3-D processing technology research program, supported by Microelectronics Advanced Research Corporation (MARCO), the Defense Advanced Research Projects Agency (DARPA) and New York state. His group has developed a 3-D integration technology platform for future ICs with high performance and functionality and low cost, and for low-cost Micro/Nano/Electro-Opto/Bio heterogeneous system integrations. He has worked in a broad range of fields, such as GaAs devices, GaN high power devices, Si bipolar device, terahertz electronics, interconnects in Si IC, advanced packaging, and high Tc superconductors.

Selected Publications:
J.-Q. Lü, A. Jindal, Y. Kwon, J.J. McMahon, M. Rasco, R. Augur, T.S. Cale, and R.J. Gutmann, "Evaluation Procedures for Wafer Bonding and Thinning of Interconnect Test Structures for 3D ICs," in 2003 IEEE International Interconnect Technology Conference (IITC), 74-76, San Francisco, (June 2003).

T. Huang, J.-Q. Lü, D. Popa, B.H. Kang, "BCB Wafer Bonding Compatible with Bulk Micro Machining," in International Electronic Packaging Technical Conference (InterPack2003), Hawaii, (July 2003).

J.-Q. Lü, A. Jindal, Y. Kwon, J.J. McMahon, K.-W. Lee, R.P. Kraft, B. Altemus, D. Cheng, E. Eisenbraun, T.S. Cale, and R.J. Gutmann, "3D System-on-a-Chip using Dielectric Glue Bonding and Cu Damascene Inter-Wafer Interconnects," in International Symposium on Thin Film Materials, Processes, and Reliability at the 203rd Meeting of The Electrochemical Society, Inc., Paris, (2003).

R.J. Gutmann, J.-Q. Lü, J.J. McMahon, P.D. Persans, T.S. Cale, E.T. Eisenbraun, J. Castracane and A.E. Kaloyeros, "Wafer-Scale High-Density Multifunctional Integration (HDMI) for Low-Cost Micro/Nano/Electro-Opto/Bio Heterogeneous Systems," in Proceedings of Nanotech 2003: The Nanotechnology Conference and Trade Show, Eds. M. Laudon and B. Romanowicz, 1, 530-533, San Francisco, (2003).

J.-Q. Lü, K.W. Lee, Y. Kwon, G. Rajagopalan, J.J. McMahon, B. Altemus, M. Gupta, E. Eisenbraun, B. Xu, A. Jindal, R.P. Kraft, J.F. McDonald, J. Castracane, T.S. Cale, A. Kaloyeros, and R.J. Gutmann, "Processing of Inter-Wafer Vertical Interconnects in 3D Ics," in Advanced Metallization Conference 2002 (AMC 2002), 18, 45-51, Eds. B.M. Melnick, T.S. Cale, S. Zaima, and T. Ohta, The Materials Research Society, (2002).

J.-Q. Lü, A. Kumar, Y. Kwon, E.T. Eisenbraun, R.P. Kraft, J.F. McDonald, R.J. Gutmann, T.S. Cale. P. Belemjain, O. Erdogan, J. Castracane, and A.E. Kaloyeros, "3-D Integration Using Wafer Bonding," in Advanced Metallization Conference 2000 (AMC 2000), 16, 515-521, Eds. D. Edelstein, G. Dixit, Y. Yasuda and T. Ohba, The Materials Research Society, (2001).

J.-Q. Lü, M.J. Hurt, W.C.B. Peatman, and M.S. Shur, "Heterodimensional Field Effect Transistors For Ultra Low Power Applications," in Proceedings of 1998 IEEE GaAs IC Symposium, Atlanta, GA, 187-190, (November 1998).

J.-Q. Lü, M.S. Shur, J.L. Hesler, L. Sun, and R. Weikle, "A Resonant Terahertz Detector Utilizing a High Electron Mobility Transistor," Digest of 1998 IEEE International Electron Devices Meeting (IEDM'98), 453-456, (December 1998).

J.-Q. Lü, M.S. Shur, J.L. Hesler, L. Sun, and R. Weikle, "Terahertz Detector Utilizing Two-Dimensional Electronic Fluid," IEEE Electron Device Letters, 19, (10), 373-375, (1998).

J.-Q. Lü and F. Koch "Random Telegraph Noise in Advanced Self-Aligned Bipolar Transistors," in Japanese Journal of Applied Physics, 35, (1), 2B, 826-832, (1996).

Contact Information:
Jian-Qiang "James" Lü
6015 Low Center for Industrial Innovation/Center for Integrated Electronics
Rensselaer Polytechnic Institute
110 Eighth Street
Troy, N.Y. 12180 USA
(518) 276-2909

E-mail: luj@rpi.edu
www.rpi.edu/~luj

 

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