Head, Professor of Materials and Science
Rensselaer Polytechnic Institute
B.S., U.S. Coast Guard Academy, 1961
Ph.D., Materials Science, Massachusetts Institute of Technology,
Duquette began his career as a commissioned
officer in the U.S. Coast Guard from 1961 through 1965. He then earned
a doctoral degree at MIT where he also served as a research assistant
for the Department of Metallurgy and Materials Science. Upon graduation,
he spent two years at Pratt & Whitney Aircraft, as a senior research
associate in the Advanced Materials Research & Development Laboratory.
In 1973, he spent six months at Imperial College of Science, Technology
and Medicine, University of London, as a visiting professor of metallurgy.
Following that assignment, he served as a visiting senior scientist
at the Max Planck Institut fur Eisenforschung in Dusseldorf, Germany.
He joined Rensselaer in 1970 and was named a full professor six years
later. Duquette has earned numerous awards, including the Alcoa Foundation
Award for Outstanding Research Achievement from 1978 to 1979; Case
Centennial Scholar; Case-Western Reserve University in 1980; and the
Humboldt Prize from the Alexander von Humboldt Foundation in 1983.
He is a fellow of both the American Society for Metals and the National
Association of Corrosion Engineers (NACE).
He served as the chairman of the Gordon Research
Conference on Corrosion in 1988 and president of Alpha Sigma Mu from
1987 to 1988; the organization named him an honorary member in 1988.
He earned the Acta Metallurgica Outstanding Paper Award in 1987 and
the Willis Rodney Whitney Award from NACE in 1990. He also presented
the Alpha Sigma Mu Distinguished Lectureship in 1991.
Duquette's current research interests include
the physical, chemical, and mechanical properties of metals and
alloys with specific reference to studies of cyclic deformation
behavior as affected by environment and temperatures, basic corrosion
studies, and stress corrosion cracking. Each of these areas is particularly
important to the ultimate use of metallic materials in engineering
applications. For example, current studies of the effects of aqueous
environments on the fatigue behavior of high strength aluminum alloys
are directed toward an understanding of accelerated failures of
these alloys in such applications as aircraft structural materials.
Fundamental studies of fatigue crack initiation in high purity metals
and alloys are directed toward a basic understanding of how surface/environment
interactions affect cyclic stress induced information. The physics
and chemistry of thin film-environment interactions are being studied
with the specific aim of determining the film characteristics, which
resist breakdown by specific ions or by stress. These studies include
the phenomena of stress corrosion cracking, pitting, and crevice
corrosion. Duquette also studies the chemistry and electrochemistry
of tailored electrolytes for optimizing chemical mechanical planarization
of interconnects for electronic applications.
"Corrosion Fatigue Crack Initiation
Processes" in Recent Advances in Fracture, Ed. R. Mahidhara,
A. Geltmacher, P. Matic, and K. Sadananda, TMS, Warrendale, Penn.,
"The Effect of Ozone on the Corrosion Behavior
of Ni-Cr-Mo Alloys in Artificial Seawater" in Electrochemical
Methods in Corrosion: Research and Application, Ed. B. Elsener,
Trans Tech Publications, Switzerland, 1997, 37-51 (with B.
K. Page and D. Duquette, "The Oxidation Behaviour
of Carbon Reinforced Glass Matrix Composites," Ceramics
International, 23, 209-214 (1997).
C. Sainio, S.P. Murarka, and D. Duquette, "An
Electrochemical Model of the Chemical-Mechanical Polishing of Copper,"
Proceedings of TECHCON '96, September 1996.
C. A. Sainio, J. M. Steigerwald, S. P. Murarka,
and D. Duquette, "Electrochemical Interactions in the Chemical-Mechanical
Polishing of Copper for Integrated Circuits," Journal of
Electronic Materials, 25, 1593 (1996).
C.A. Sainio and D. Duquette, "Electrochemical
Interactions During the Chemical-Mechanical Planarization of Copper
in Ammonium-Based Slurries," Proceedings of First International
Symposium on Chemical Mechanical Planarization (CMP) in IC Device
Manufacturing, Eds. I. Ali and S. Raghavan, The Electrochemical
Society, Pennington, N.J., 110-117 (1997).
J. Might and D. Duquette, "Stress Corrosion
Cracking of High-Purity Carbon Steel in Carbonate Solutions,"
Corrosion, 52, 428-435 (1996).
B.E., Brown, W. E. Wyllie II, and D. Duquette,
"The Corrosion Behavior of Titanium (Grade 2) in Alkaline Peroxide
Bleach Liquors" TAPPI Journal, 78, 151-160 (1996).
R.J. Gutmann, J.M. Steigerwald, Y. Lou, D.T. Price,
J. Neirynck, S.P. Murarka, and D. Duquette, "Chemical-Mechanical
Polishing of Copper with Oxide and Polymer Interlevel Dielectrics,"
Thin Solid Films, 270, 596-600 (1995).
J.M. Steigerwald, S.P. Murarka, J. Ho, R.J. Gutmann,
and D. Duquette, "Mechanisms of Copper Removal During Chemical
Mechanical Polishing", Journal of Vacuum Science and Technology,
13, 2215-2218 (1995).
103 Materials Research Center
Rensselaer Polytechnic Institute
110 Eighth Street
Troy, N.Y. 12180 USA
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