David Duquette
— Head, Professor of Materials and Science Engineering,
Rensselaer Polytechnic Institute

— B.S., U.S. Coast Guard Academy, 1961
— Ph.D., Materials Science, Massachusetts Institute of Technology, 1968

Career Highlights:
Duquette began his career as a commissioned officer in the U.S. Coast Guard from 1961 through 1965. He then earned a doctoral degree at MIT where he also served as a research assistant for the Department of Metallurgy and Materials Science. Upon graduation, he spent two years at Pratt & Whitney Aircraft, as a senior research associate in the Advanced Materials Research & Development Laboratory. In 1973, he spent six months at Imperial College of Science, Technology and Medicine, University of London, as a visiting professor of metallurgy. Following that assignment, he served as a visiting senior scientist at the Max Planck Institut fur Eisenforschung in Dusseldorf, Germany. He joined Rensselaer in 1970 and was named a full professor six years later. Duquette has earned numerous awards, including the Alcoa Foundation Award for Outstanding Research Achievement from 1978 to 1979; Case Centennial Scholar; Case-Western Reserve University in 1980; and the Humboldt Prize from the Alexander von Humboldt Foundation in 1983. He is a fellow of both the American Society for Metals and the National Association of Corrosion Engineers (NACE).

He served as the chairman of the Gordon Research Conference on Corrosion in 1988 and president of Alpha Sigma Mu from 1987 to 1988; the organization named him an honorary member in 1988. He earned the Acta Metallurgica Outstanding Paper Award in 1987 and the Willis Rodney Whitney Award from NACE in 1990. He also presented the Alpha Sigma Mu Distinguished Lectureship in 1991.

Research Areas:
Duquette's current research interests include the physical, chemical, and mechanical properties of metals and alloys with specific reference to studies of cyclic deformation behavior as affected by environment and temperatures, basic corrosion studies, and stress corrosion cracking. Each of these areas is particularly important to the ultimate use of metallic materials in engineering applications. For example, current studies of the effects of aqueous environments on the fatigue behavior of high strength aluminum alloys are directed toward an understanding of accelerated failures of these alloys in such applications as aircraft structural materials. Fundamental studies of fatigue crack initiation in high purity metals and alloys are directed toward a basic understanding of how surface/environment interactions affect cyclic stress induced information. The physics and chemistry of thin film-environment interactions are being studied with the specific aim of determining the film characteristics, which resist breakdown by specific ions or by stress. These studies include the phenomena of stress corrosion cracking, pitting, and crevice corrosion. Duquette also studies the chemistry and electrochemistry of tailored electrolytes for optimizing chemical mechanical planarization of interconnects for electronic applications.

Selected Publications:
"Corrosion Fatigue Crack Initiation Processes" in Recent Advances in Fracture, Ed. R. Mahidhara, A. Geltmacher, P. Matic, and K. Sadananda, TMS, Warrendale, Penn., 1997, 227-238.

"The Effect of Ozone on the Corrosion Behavior of Ni-Cr-Mo Alloys in Artificial Seawater" in Electrochemical Methods in Corrosion: Research and Application, Ed. B. Elsener, Trans Tech Publications, Switzerland, 1997, 37-51 (with B. Brown).

K. Page and D. Duquette, "The Oxidation Behaviour of Carbon Reinforced Glass Matrix Composites," Ceramics International, 23, 209-214 (1997).

C. Sainio, S.P. Murarka, and D. Duquette, "An Electrochemical Model of the Chemical-Mechanical Polishing of Copper," Proceedings of TECHCON '96, September 1996.

C. A. Sainio, J. M. Steigerwald, S. P. Murarka, and D. Duquette, "Electrochemical Interactions in the Chemical-Mechanical Polishing of Copper for Integrated Circuits," Journal of Electronic Materials, 25, 1593 (1996).

C.A. Sainio and D. Duquette, "Electrochemical Interactions During the Chemical-Mechanical Planarization of Copper in Ammonium-Based Slurries," Proceedings of First International Symposium on Chemical Mechanical Planarization (CMP) in IC Device Manufacturing, Eds. I. Ali and S. Raghavan, The Electrochemical Society, Pennington, N.J., 110-117 (1997).

J. Might and D. Duquette, "Stress Corrosion Cracking of High-Purity Carbon Steel in Carbonate Solutions," Corrosion, 52, 428-435 (1996).

B.E., Brown, W. E. Wyllie II, and D. Duquette, "The Corrosion Behavior of Titanium (Grade 2) in Alkaline Peroxide Bleach Liquors" TAPPI Journal, 78, 151-160 (1996).

R.J. Gutmann, J.M. Steigerwald, Y. Lou, D.T. Price, J. Neirynck, S.P. Murarka, and D. Duquette, "Chemical-Mechanical Polishing of Copper with Oxide and Polymer Interlevel Dielectrics," Thin Solid Films, 270, 596-600 (1995).

J.M. Steigerwald, S.P. Murarka, J. Ho, R.J. Gutmann, and D. Duquette, "Mechanisms of Copper Removal During Chemical Mechanical Polishing", Journal of Vacuum Science and Technology, 13, 2215-2218 (1995).

Contact Information:
David Duquette
103 Materials Research Center
Rensselaer Polytechnic Institute
110 Eighth Street
Troy, N.Y. 12180 USA
(518) 276-6490

E-mail: duqued@rpi.edu


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