Rensselaer’s Nanopatterning and
fabrication clean room is a state-of-the-art, 10,000-square-foot, Class
100 multi-user facility with tools and infrastructure. MNCR currently
performs end-to-end device fabrication, characterization, metrology and
testing services to users from universities, local start-ups, and
industrial institutions for research, education, and economic
development. The facility has recently been upgraded to 8” wafer size
with over $4M tools and infrastructure. While the facility is an 8”
operation, it routinely processes 2-8” wafers for high speed
electronics, power devices, ICs, and microsystems. In addition, the
facility has a dedicated staff of six personnel to provide process
solutions, training, teaching, and administration.
A schematic of MNCR’s hyperintegration
(wafer-to-wafer 3D) interconnect capability.
Some of the unique capabilities of the
center include the ability to define 3D interconnects for
hyperintegration (alignment, bonding, wafer thinning, through wafer via
definition by deep- oxide and Silicon etching and metallization).
Hyperintegration involves vertical wafer-wafer 3D interconnect
architectures, associated materials, and process technologies. The
tools for this include a state-of-the-art EVG aligner, copper
deposition and CMP equipment, deep-Silicon and oxide etchers. MNCR also
has state-of-the-art CMP and Copper metallization (barrier, seed, dep.
or electroplating) capabilities.