TRANSIENT IONIZING RADIATION EFFECTS ON IMPATT DIODE OSCILLATORS, IEEENuclear and Space Radiation Effects Conference, Seattle, WA, July 1972,pp. 243-246, co-author, with J.M. Borrego, P.E. Cottrell, S.K. Ghandhi.
OPERATION OF TRAPATT OSCILLATORS UNDER TRANSIENT IONIZING RADIATIONCONDITION, IEEE Nuclear and Space Radiation Effects Conference, Logan,UT, July 1973, pp. 135-140, co-author, with J.M. Borrego, H. Geipel,S.K. Ghandhi.
PERFORMANCE OF AVALANCHE OSCILLATORS WITH LARGE LEAKAGE CURRENT, IEEEInternational Microwave Symposium, Atlanta, GA, July 1974, pp. 306-308,co-author, with J.M. Borrego.
TRANSIENT IONIZING RADIATION EFFECTS IN BARITT DIODE OSCILLATORS, IEEENuclear and Space Radiation Effects Conference, Arcata, CA, July 1975,pp. 231-234, co-author, with J.M. Borrego, J. Narian.
THE IMPACT OF TWO-WAY INTERACTIVE COMMUNICATION ON CABLE TELEVISIONSYSTEMS, National Telecommunications Conference, New Orleans, LA,December 1975, pp. 36-5 - 36-9, co-author, with T. Everitt, K. Rose.
EXPERIMENTAL EVALUATION OF AFTEREFFECTS IN IMPATT OSCILLATORS WITHTRANSIENT IONIZING RADIATION, IEEE Nuclear and Space Radiation EffectsConference, San Diego, CA, July 1976, page 73, co-author, with J.M. Borrego.
NEUTRON RADIATION EFFECTS IN GOLD AND ALUMINUM GaAs SCHOTTKY DIODES,IEEE Nuclear and Space Radiation Effects Conference, San Diego, CA, July1976, page 30, co-author, with J.M. Borrego, S. Ashok.
INTERFACE STATE DENSITY IN Au AND Al nGaAs SCHOTTKY DIODES, International Electron Device Conference, Washington, DC, December 1976,pp. 365-368, co-author, with J.M. Borrego, S. Ashok.
RADIATION EFFECTS ON GaAs MIS SCHOTTKY DIODES, IEEE Nuclear and SpaceRadiation Effects Conference, Albuquerque, NM, July 1978, pp. 175-180,co-author, with S. Ashok, J.M. Borrego.
RADIATION EFFECTS IN GaAs MESFETs, IEEE Nuclear and Space RadiationEffects Conference, Albuquerque, NM, July 1978, pp. 328-332, co-author,with J.M. Borrego, S. Moghe, M. Chudzicki.
POWER COMBINING IN AN ARRAY OF MICROWAVE POWER RECTIFIERS, IEEE/MTTInternational Microwave Symposium, Orlando, FL, May 1979, pp. 453-455,co-author, with J.M. Borrego.
OPTICAL-MICROWAVE EFFECTS IN IMPATT DIODE OSCILLATORS, IEEE/MTTInternational Microwave Symposium, Orlando, FL, May 1979, pp. 188-190,co-author, with H.P. Vyas, J.M. Borrego.
RADIATION EFFECTS ON SIGNAL AND NOISE CHARACTERISTICS OF GaAs MESFETMICROWAVE AMPLIFIERS, IEEE Nuclear and Space Radiation EffectsConference, Santa Cruz, CA, July 1979, pp. 192-194, co-author, with J.M.Borrego, S. Moghe.
OPTICAL-TUNING IN GaAs MESFET OSCILLATORS, IEEE International MicrowaveSymposium, Los Angeles, CA, June 1981, pp. 40-42, co-author, with H.J.Sun, J.M. Borrego.
VLSI DESIGN AUTOMATION AND INTERACTIVE MODELING FOR ELECTRON BEAMLITHOGRAPHY, IEEE Custom Integrated Circuit Conference, May 1981, pp.37-39, co-author, with A.J. Steckl, J.F. McDonald.
RADIATION EFFECTS ON DISTORTION CHARACTERISTICS OF POWER GaAs MESFETAMPLIFIERS, IEEE Nuclear and Space Radiation Effects Conference,Albuquerque, NM, July 1982, pp. 180-183, co-author, with S. Moghe, J.M.Borrego.
CHARACTERIZATION OF THE DFZ IN SILICON WAFERS BY A NON-DESTRUCTIVETECHNIQUE, Materials Research Society Symposium on MaterialsCharacterization, Palo Alto, CA, April 1986, pp. 373-378, co-author,with J.M. Borrego, N. Jensen, O. Paz.
CHARACTERIZATION AND DESIGN OF GaAs MESFETs FOR BROADBAND CONTROLAPPLICATIONS, IEEE/MTT International Microwave Symposium, Baltimore, MD,June 1986, co-author, pg. 389-392, with D. Fryklund, D. Menzer.
NON-DESTRUCTIVE EVALUATION OF Si AND GaAs WAFERS USINGMICROWAVE-DETECTED PHOTOCONDUCTIVITY, Conference on Lasers andElectrooptics, San Francisco, CA, June 1986, co-author, with J.M.Borrego, N. Jensen, C.S. Lo, O. Paz.
MICROWAVE-DETECTED PHOTOCONDUCTIVITY TRANSIENT SPECTROSCOPY FOR NON-DESTRUCTIVE EVALUATION OF GaAs WAFERS, International Society of Photo-Instrumentation Engineers meeting on Modern Optical Characterization Techniques for Semiconductors and Semiconductor Devices, Bay Point, Florida, March 1987; co-author with J.M. Borrego, C.S. Lo, M.C. Heimlich, O. Paz.
THE ELECTRON DISTRIBUTION FUNCTION IN GaAs AND AlGaAs UNDER HIGH FIELD CONDITIONS USING THE ITERATIVE PATH INTEGRAL SOLUTION OF THE BOLTZMANN TRANSPORT EQUATION, Workshop on Ballistic Electrons for Transistors, Santa Barbara, CA., March 1987, with C. Wong, J.M. Borrego.
DEEP LEVEL CHARACTERIZATION IN SEMI-INSULATING GaAs WAFERS BY PHOTOINDUCED MICROWAVE REFLECTION, International Symposium on Defect Recognition and Image Processing in III-V Compounds, Monterey, CA, April 1987, pp. 177-184, with J.M. Borrego C.S. Lo, M.C. Heimlich, O. Paz.
MICROWAVE SCANNING MICROSCOPY FOR PLANAR STRUCTURE DIAGNOSTICS, International Microwave Symposium, Las Vegas, NV, June 1987, pp. 281-284, with J.M. Borrego, P. Chakrabarti and M.S. Wang.
MICROWAVE TECHNIQUES FOR NON-DESTRUCTIVE TESTING OF INHOMOGENEITIES OF INTEGRATED CIRCUITS AND SEMICONDUCTOR WAFERS, South America Microwave Conference, Sao Paola, Brazil, July 1987, with M.S. Wang, P. Chakrabarti, C.S. Lo, O. Paz, and J.M. Borrego.
SHALLOW ACCEPTOR CONCENTRATION PROFILING IN LEC SI-GaAs WAFERS USING MICROWAVE REFLECTION, US Conference on GaAs Manufacturing Technology, Portland, OR, October 1987, pp. 101-105, with J.M. Borrego, C.S. Lo, M. Heimlich and O. Paz
ZONE-MELT RECRYSTALLIZATION OF SILICON ON ALUMINA, Materials Research Society Meeting, Boston, MA, November 1987, with E. Maby and T. Letavic.
GaAs SEMI-INSULATED-GATE FETs (SIGFETs) AS HIGH POWER MMIC CONTROL DEVICES, International Microwave Symposium, New York City, May 1988, pp. 997-1001, with Y.H. Yun.
ANNEALING AND ION IMPLANTATION EFFECTS IN SEMI-INSULATING GaAs OBTAINED FROM PHOTOINDUCED MICROWAVE REFLECTANCE, State-of-the-Art Program on Compound Semiconductors (SOTAPOCS IX), Chicago, IL, October 1988, with C. Campbell, J. M. Borrego, D. Bliss.
VISCOELASTIC STRAIN RELIEF IN PATTERNED SILICON-ON-INSULATOR STRUCTURES,
Materials Research Society Fall Meeting, Bost
on, MA, November 1988, pg. 327-332, with T. Letavic and E. W. Maby.
RECRYSTALLIZED SILICON-ON-ALUMINA AS A MICROWAVE MONOLITHIC CONTROL TECHNOLOGY, International Microwave Symposium, Long Beach, CA, June 1989, pg. 969-972, with T. Letavic, S. Wu and E. W. Maby.
DESIGN OF GaAs MESFETs FOR MICROWAVE CONTROL APPLICATIONS, invited review paper, 1989 SBMO Microwave Symposium, Sao Paulo, Brazil, July 1989, pg. 829-839.
GaAs MESFET AND RELATED STRUCTURES FOR BROADBAND MICROWAVE MONOLITHIC CONTROL APPLICATIONS, invited review paper, 1989 European Microwave Meeting, London, England, September 1989, pg. 107-118.
LOW DISTORTION GaAs MESFET CONTROL COMPONENTS FOR BASEBAND APPLICATIONS, 1989 GaAs IC Symposium, San Diego, CA, October 1989, pp. 169-172, with N. Jain.
ELECTRICAL PROPERTIES OF SIPOS FILMS DEPOSITED ON CRYSTALLINE SILICON, 1989 Materials Research Society Fall Meeting, Boston, MA, December 1989, with T. M. Chuang and K. Rose.
HIGH POWER GaAs MMIC SWITCHES WITH PLANAR SEMI-INSULATED-GATE FETs, 1990 International Symposium on Power Semiconductor Devices and ICs, Tokyo, Japan, April 1990, pg. 55-58, with Y. H. Yun and D. Johnson.
DAMAGE-INDUCED EFFECTS IN CO-IMPLANTED (BURIED LAYER) LEC GaAs, 1990 Semi-Insulating III-V, Materials Conference, Toronto, May 1990, pp. 367-372, with M. Heimlich, D. Seielstaed and D. Hou.
PHOTOINDUCED MICROWAVE REFLECTOMETRY AS A NON-INVASIVE TECHNIQUE FOR S.I. InP WAFER CHARACTERIZATION, 1990 Semi-Insulating III-V Materials Conference, Toronto, May 1990, pp. 323-328, with M. Heimlich, M. Tait, R. Bylsma and E. Monberg.
SIMULATION OF SUB-MICRON GaAs MESFETs FOR MICROWAVE CONTROL, Workshop on Computational Electronics, University of Illinois, May 1990, with S. Khan.
MODELING AND CHARACTERIZATION OF SIPOS EMITTER BIPOLAR TRANSISTORS, 1990 International Electron Devices and Materials Society, Taiwan, Nov. 1990, pp. 30-33, with T.M. Chuang and K. Rose.
BROADBAND GaAs MESFET CONTROL DEVICES FOR MMICs, 1990 International Conference on Millimeter Waves and Microwaves, Dehra, India, Dec. 1990, pp. 744-747, with N. Jain.
TWO DIMENSIONAL MAPPING OF IMPLANTATION AND ANNEALING PHENOMENA IN GaAs BY PHOTO-INDUCED MICROWAVE REFLECTION, Defect Recognition and Imaging in Semiconductors before and after Processing, Manchester, England, March 1991, pp. 275-278, with M. Heimlich and E. Atwood.
LOW DIELECTRIC CONSTANT INTERCONNECT TECHNOLOGY - A PARADIGM FOR INTERDISCIPLINARY INDUSTRY-UNIVERSITY PROGRAMS, University/Government/ Industry Microelectronics Symposium, Melbourne, Florida, June 1991, pp. 33-36, with R. Isaac.
THE MICROELECTRONICS MANUFACTURING ENGINEERING PROGRAM AT RENSSELAER POLYTECHNIC INSTITUTE, University/Government/Industry Microelectronics Symposium, Melbourne, Florida, June 1991, pp. 41-44, with J. Hudson.
SCALING STUDIES OF GaAs FETs USING NOVEL TECHNIQUE FOR SIMULATION OF NON-STATIONARY TRANSPORT, 1991 IEEE Conf. on Advanced Concepts in High Speed Semiconductor Devices and Circuits, Ithaca, New York, Aug. 1991,pp. 121-130, with S. Khan.
MODELLING OF PULSE DOPED FET STRUCTURES, 1991 Meeting of the GaAs Simulation Group, Lille, France, Oct. 1991, with J. Jere and C. Snowden.
DEVICE-QUALITY RECRYSTALLIZED SILICON FILMS ON ALUMINA SUBSTRATES USING PATTERNED STRUCTURES, Materials Research Society, Fall Meeting, Boston, MA, November 1991, with T. Letavic and E. Maby.
CHARACTERIZATION OF ION IMPLANTATION CHANNELING BY PIMR, 7th Conference on Semi-Insulating III-V Materials, Ixtapu, Mexico, April 1992, with M. Heimlich, L. Kerber and S. Moreau.
INVESTIGATION OF IMPLANT ANNEALING AND ACTIVATION BY PIMR, 7th Conference on Semi-Insulating III-V Materials, Ixtapu, Mexico, April 1992, with M. Heimlich, K. Kerber and J. Vaughan.
SPECTRAL DECOMPOSITION OF MAPPED PIMR SEMICONDUCTOR WAFER CHARACTERIZATION OF DATA USING NUMERICAL FREQUENCY DOMAIN METHODS, State of the Art Program on Compound Semiconductors (SOTAPOCS XVI), St. Louis, MO, May 1992, with E. Atwood.
IN-SITU THICKNESS MONITOR FOR CONDUCTING FILMS, International Microwave Symposium, Albuquerque, NM, June 1992, pp. 1561-1564, with S. Khan, J. Farmer and J. Borrego.
A MICROWAVE-CAVITY RESONANCE TECHNIQUE FOR CHARACTERIZING DIELECTRIC THIN FILMS, VLSI Multilevel Interconnection Conference (V-MIC), Santa Clara, CA, June 1992, pp. 477-479, with M. Heimlich and S. Khan.
INVESTIGATIONS OF THE CHEMICAL-MECHANICAL POLISHING OF COPPER FILMS TO DELINEATE INTERCONNECTIONS IN A MULTILAYER SCHEME, Advanced Metallization Conference, Phoenix, AR, Oct. 1992, with J. Steigerwald and S.P. Murarka.
ADVANCED MULTILAYER METALLIZATION SCHEMES WITH COPPER, International SPIE Meeting, San Diego, CA, Feb. 1993, with S.P. Murarka, A.E. Kaloyeros and W.A. Lanford.
ADVANCED MULTILAYER METALLIZATION SCHEMES WITH COPPER AS INTERCONNECTION METAL", presented at ICMCTF, San Diego, CA, Apr. 19-23, 1993, with S.P. Murarka, A.E. Kaloyeros and W.A. Lanford.
THE COUPLING OF AN N-WELL CMOS FABRICATION LABORATORY COURSE WITH THE SEMATECH CENTER OF EXCELLENCE IN MULTILEVEL METALLIZATION AT RENSSELAER, 10th Annual Biennial University/Government/ Industry Microelectronics Symposium, Research Triangle Park, NC, May 1993, with D.T. Price, N.J. Haley, S.P. Murarka, A.N. Saxena, T.P. Chow, K. RamKumar, S. Lakshminarayanan, A. Bhalla.
ELECTROCHEMICAL EFFECTS IN THE CHEMICAL-MECHANICAL POLISHING OF COPPER AND TITANIUM THIN FILMS USED FOR MULTILEVEL INTERCONNECT SCHEMES, Proc. of 10th Int. VMIC, T.E. Wade, ed., Univ. of S. Florida, Tampa, FL, June 7-10, 1993, with J. Steigerwald and S.P. Murarka.
SUBMICRON CONTACT STRUCTURES WITH COPPER INTERCONNECTS FABRICATED BY DUAL DAMASCENE TECHNOLOGY, SRC Techcon Conference, Atlanta, GA, Sept 1993, with S. Lakshminarayanan, J. Steigerwald, D. Price, J. Trogolo, M. Bourgeois, T.P. Chow and S.P. Murarka.
SUBMICRON CONTACT STRUCTURES WITH COPPER INTERCONNECTS FABRICATED BY DUAL DAMASCENE TECHNOLOGY, Proceedings of TECHCON '93, Sept. 1993, pp. 390-392, with S. Lakshminarayanan, J. Steigerwald, D. Price, J. Trogolo, M. Bourgeois, and S.P. Murarka.
ELECTROCHEMICAL EFFECTS OF CHEMICAL-MECHANICAL POLISHING AND CORROSION RATE OF COPPER FILMS, Proceedings of TECHCON '93, Sept. 1993, pp. 387-389, with J. Steigerwald and S.P. Murarka.
COPPER METALLIZATION MANUFACTURING ISSUES FOR FUTURE ICs, MRS Symposium, April 1994, with T.P. Chow, W.N. Gill, S.P. Murarka, A.E. Kaloyeros and W.A. Lanford, MRS Vol. 337, pp. 41-58
SURFACE LAYER FORMATION DURING THE CMP OF COPPER THIN FILMS, MRS Symposium, April 1994, with J.M. Steigerwald, S.P. Murarka and D.J. Duquette, MRS Vol. 337, pp. 133-138.
A NEW SLURRY FOR CHEMICAL-MECHANICAL POLISHING OF TUNGSTEN, MRS Symposium, April 1994, with K. Yang, S.P. Murarka, E. Stonebraker and H. Atkins, MRS Vol. 337, pp. 145-149.
INTERCONNECT TECHNOLOGIES FOR HIGH PERFORMANCE ELECTRONIC SYSTEMS, International Conference on Advanced Microelectronic Devices and Processing, Sendai, Japan, March 1994, invited.
DUAL DAMASCENE COPPER METALLIZATION PROCESS USING CHEMICAL MECHANICAL POLISHING, International Conference on Metallurgical Coatings and Thin Films, San Diego, CA, April 1994, with T.P. Chow, S. Lakshminarayanan, J. Steigerwald, D. Price, M. Bourgeois and S.P. Murarka, invited.
COPPER INTERCONNECTION/PATTERNING: EFFECTS OF METAL DISHING AND OXIDE EROSION DURING CMP, 1994 VMIC, June 1994, with J.M. Steigerwald, R. Zirpoli, S.P. Murarka and D. Price.
DUAL DAMASCENE COPPER METALLIZATION PROCESS USING CHEMICAL-MECHANICAL POLISHING, 1994 VMIC, June 1994, with S. Lakshminarayanan, J. Steigerwald, D. Price, M. Bourgeois, T.P. Chow and S.P. Murarka.
OMVPE GROWTH AND CHARACTERIZATION OF InGaAs FOR TPV CELLS, NREL Conference on Thermoelectric Generation of Electricity, Copper Mountain, CO, July 1994, with H. Ehsani, I. Bhat, D. Marcy, G. Nichols, J. Borrego and J. Parrington.
CHARACTERIZATION OF InGaAs TPV CELLS, NREL Conference on Thermoelectric Generation of Electricity, Copper Mountain, CO, July 1994, with M. Zierak, J. Borrego, I. Bhat, H. Ehsani and D. Marcy.
METAL DISHING AND OXIDE EROSION IN THE CMP OF COPPER USED FOR PATTERN DELINEATION, Advanced Metallization for VLSI Conference, Oct. 1994, with J.M. Steigerwald, R. Zirpoli, S.P. Murarka and D. Price.
APPLICATION OF CORROSION ENGINEERING PRINCIPLES TO THE CHEMICAL MECHANICAL POLISHING OF COPPER, Advanced Metallization for VLSI Conference, Oct. 1994, with J.M. Steigerwald, S.P. Murarka and D.J. Duquette.
ASSESSMENT OF AGILE MANUFACTURING FOR THE ELECTRONICS SECTOR, Agility Forum Conference, Vol. 4, March 1995, pp. 309-318, with R. Graves.ELECTRONICS PACKAGING OF INTEGRATED CIRCUIT CHIPS - AN OPPORTUNITY FOR AGILITY IN THE ELECTRONICS SECTOR, Agility Forum Conference, Vol. 4, March 1995, pp. 453-463, with D. Millard.
INTEGRATION OF COPPER MULTILEVEL INTERCONNECTS WITH OXIDE AND POLYMER INTERLEVEL DIELECTRICS, International Conference on Metallurgical Coatings and Thin Films, April 1995, with T.P. Chow, S. Lakshminaraynan, D. Price, J.M. Steigerwald, L. You and S.P. Murarka, invited.
CHEMICAL-MECHANICAL POLISHING OF COPPER WITH OXIDE AND POLYMER INTERLEVEL DIELECTRICS, International Conference on Metallurgical Coatings and Thin Films, April 1995, with J.M. Steigerwald, L. You, D. Price, DJ. Duquette and S.P. Murarka.
LOW DIELECTRIC CONSTANT POLYMERS FOR ON-CHIP INTERLEVEL DIELECTRICS WITH COPPER METALLIZATION, MRS Spring Meeting, April 1995, with T. Paul Chow, D.J. Duquette, T-M. Lu, J.F. McDonald and S.P. Murarka, invited.
INVESTIGATIONS OF CHEMICAL-MECHANICAL POLISHING OF POLYMER FILMS FOR ILD APPLICATIONS, MRS Spring Meeting, April 1995, with J. Neirynck and S. Murarka.
AN INVESTIGATION OF THE CMP OF COPPER THIN FILMS TO FORM INLAID INTERCONNECTIONS IN DIELECTRIC (SIO2) FILMS, 11th Biennial University, Government and Industry Microelectronics Symposium, May 1995, with J. Steigerwald, S. Murarka and D. Duquette.
GaSb AND GaInSb LAYERS GROWN BY MOVPE, Second NREL Conference on Thermophotovoltaic Generation of Electricity, July 1995, with H. Ehsani, I. Bhat, C. Hitchcock and J. Borrego.
INDIUM OXIDE PLASMA FILTERS DEPOSITED BY APCVD, Second NREL Conference
on Thermophotovoltaic Generation of Electricity, July 1995, with S.
Dakshmamurthy, E. Langlois, I. Bhat, E. Brown, R. Dziendziel, M. Freeman
and N. Choudhury.
DEGENERATELY DOPED SILICON FOR SPECTRAL CONTROL IN TPV SYSTEMS, Second NREL Conference on Thermophotovoltaic Generation of Electricity, July 1995, with H. Ehsani, I. Bhat, J. Borrego, E. Brown, R. Dziendziel, M. Freeman and N. Choudhury.
CHEMICAL-MECHANICAL POLISHING OF PECVD SILICON NITRIDE, International CMP for VLSI/VLSI Multilevel Interconnect Conference (CMP-MIC), February 1996, pp. 97-104, with Y.Z. Hu and T.P. Chow.
PARYLENE-N AND BCB ILDs WITH DAMASCENE COPPER INTERCONNECTS, SEMATECH Low Dielectric Constant Materials and Interconnects Workshop, April 1996, with D.T. price and S.P. Murarka.
ASSESSMENT OF DEMONSTRATION PROJECTS OF AGILITY IN THE ELECTRONICS SECTOR: A METHODOLOGY AND INITIAL RESULTS, Agility Forum Conference, Vol. 5, March 1996, pp. 481-487, with K. Chen and R. Graves.
CHEMICAL-MECHANICAL POLISHING PROCESSING AND MECHANISMS WITH PECVD SILICON NITRIDE, International Conference on Metallurgical Coatings and Thin Films, April 1996, with Y.Z. Hu and T.P. Chow.
THE ADDITION OF SURFACTANT TO SLURRY FOR POLYMER CMP, International Conference on Metallurgical Coatings and Thin Films, April 1996, with J. Neirynck and S.P. Murarka.
TPV ENERGY CONVERSION: A REVIEW OF MATERIAL AND CELL RELATED ISSUES, Intersociety Energy Conversion Engineering Conference, August 1996, paper 96330 (6 pages) with I.B. Bhat, J.M. Borrego, and A.G. Ostrogorsky.
SIMULATION OF SLOW WAVE MODE PROPAGATION USING THE FINITE ELEMENT METHOD, European Microwave Conference, Prague, Czech Republic, September 1996, pp. 486-492, with J. Kucera.
LOW AND HIGH DIELECTRIC CONSTANT THIN FILMS FOR INTEGRATED CIRCUIT APPLICATIONS, Advanced Metallization and VLSI Interconnect Systems Conference, October 1996, with W. gill, T.M. Lu, J. McDonald, S. Murarka and E. Rymaszewski, invited.
CHEMICAL-MECHANICAL POLISHING OF PARYLENE N AND BENZOCYCLOBUTENE FILMS, Materials Research Conference, March 1997, with G.R. Yang, Y.P. Zhao, J.M. Neirynck, and S.P. Murarka.
DAMASCENE COPPER INTERCONNECTS WITH POLYMER ILDS, International Conference on Metallurgical Thin Films and Coatings, April 1997, with D.T. Price and S.P. Murarka.
CHEMICAL-MECHANICAL POLISHING AS AN ENABLING TECHNOLOGY FOR GIANT MAGNETORESISTANCE (GMR) DEVICES, International Conference on Metallurgical Thin Films and Coatings, April 1997, with Y.Z. Hu, T.P. Chow, K. Bussmann, S.F. Cheng and G.A. Prinz.
GROWTH AND CHARACTERIZATION OF InGaSb DEVICE STRUCTURES USING METALORGANIC VAPOR PHASE EPITAXY, Third NREL Conference on Thermophotovoltaic Generation of Electricity, June 1997, with H. Ehsani, I. Bhat, C. Hitchcock, G. Charache and M. Freeman.
GaInSb AND GaInaSB THERMOPHOTOVOLTAIC DEVICE FABRICATION AND CHARACTERIZATION, Third NREL Conference on Thermophotovoltaic Generation of Electricity, June 1997, with C. Hitchcock, J. Borrego, H. Ehsani, I. Bhat, M. Freeman and G. Charache.
RF/MICROWAVE NON-DESTRUCTIVE MEASUREMENTS OF ELECTRICAL PROPERTIES OF SEMICONDUCTOR WAFERS FOR THERMOPHOTOVOLTAIC APPLICATIONS, Third NREL Conference on thermophotovoltaic Generation of Electricity, June 1997, with S. Saroop, J. Borrego, H. Ehsani, I. Bhat, S.D. Murthy, A. Ostrogorsky, P. Dutta, M. Freeman and G. Charache.
BULK GROWTH OF GaSb AND GaInSb, Third NREL Conference on Thermophotovoltaic
Generation of Electricity, June 1997, with P. Dutta and A. Ostrogorsky.
MODELING OF InGaSb THERMOPHOTOVOLTAIC CELLS AND MATERIALS, Third NREL
Conference on Thermophotovoltaic Generation of Electricity, June 1997,
with M. Zierak, J. Borrego, I. Bhat and G. Charache.
COPPER INTERCONNECTS FOR SILICON ICs AND ALTERNATIVE DENSELY PACKED INFORMATION TECHNOLOGIES, International Workshop on Future Information Processing Technologies, August 1997, invited.
VOLTAGE HANDLING CAPABILITY AND MICROWAVE PERFORMANCE OF A 4H-SiC MESFET, International Device Research Conference, September 1997, with V. Khemka and T.P. Chow.
CMP OF COPPER-POLYMER INTERCONNECT STRUCTURES, Chemical-Mechanical Planarization of ULSI Multilevel Interconnect Conference, February 1998, with D.T. Price, J.M. Neirynck, C. Saino, P. Permana, D.J. Duquette and S.P. Murarka, invited.
CHARACTERIZATION OF LOW-K MATERIALS FOR INTERLEVEL DIELECTRIC APPLICATIONS, Dielectrics for ULSI Multilevel Interconnect Conference, February 1988, with T-M. Lu, P.S. Ho and S.P. Murarka, invited.
PROCESSING ISSUES IN COPPER-POLYMER DUAL DAMASCENE PATTERNING, International Conference on Metallurgical Coatings and Thin Films, April 1998, with D.T. Price.
FABRICATION AND CHARACTERIZATION OF GaSb-BASED THERMOPHOTOVOLTAIC CELLS USING ZN DIFFUSION FROM A DOPED SPIN-ON GLASS SOURCE, Electronic Materials Conference, June 1998, with S. Dakshinamurthy, S. Shetty, I. Bhat, C. Hitchcock, G. Charache and M. Freeman.
REOXIDATION CHARACTERISTICS OF OXYNITRIDES ON 3C- AND 4H-SiC, Electronic Materials Conference, June 1998, with K. Chatty, V. Khemka, and T. Paul Chow
EFFECT OF REACTIVE ION ETCH DAMAGE ON 4H-SiC SCHOTTKY SURFACES, Electronic Materials Conference, June 1998, with V. Khemka and T. Paul Chow.
CHARACTERIZATION OF RECOMBINATION PROCESSES IN DOUBLY-CAPPED QUATERNARY THIN FILMS FOR ANTIMONIDE-BASED THERMOPHOTOVOLTAIC DEVICES, Electronic Materials Conference, June 1998, with S. Saroop, J. Borrego, G. Charache and C. Wang.
TERNARY AND QUATERNARY ANTIMONIDE DEVICES FOR THERMOPHOTOVOLTAIC APPLICATIONS, Ninth International Conference on Metalorganic Vapor Phase Epitaxy, June 1998, with C. Hitchcock, H. Ehsani, I. Bhat, C. Wang, M. Freeman and G. Charache.
P-TYPE AND N-TYPE COPING IN GaSb AND Ga0.8In0.2Sb LAYERS GROWN BY METALORGANIC VAPOR PHASE EPITAXY, Ninth International Conference on Metalorganic Vapor Phase Epitaxy, June 1998, with H. Ehsani, I. Bhat, C. Hitchcock, G. Charache and M. Freeman.
BULK CRYSTAL GROWTH OF ANTIMONIDE-BASED III-V COMPOUNDS FOR TPV APPLICATIONS, Fourth NREL Conference on Thermophotovoltaic Generation of Electricity, August 1998, with P.S. Dutta and A.G. Ostrogorsky.
RF PHOTOREFLECTANCE CHARACTERIZATION OF BINARY AND QUASI-BINARY SUBSTRATES AND ANTIMONIDE-BASED TPV DEVICES, Fourth NREL Conference on Thermophotovoltaic Generation of Electricity, August 1998, with S. Saroop, J.M. Borrego, P.S. Dutta, A.G. Ostrogorsky and G.W. Charache.
ADVANCED SILICON IC INTERCONNECT TECHNOLOGY: PRESENT TRENDS AND RF WIRELESS IMPLICATIONS, 1998 IEEE Radio and Wireless Conference (RAWCON), August 1998.
A NON-LINEAR INTEGRATOR MODEL USED TO DESIGN A ROBUST 16-BIT, 40KSPS SWITCHED CAPACITOR SIGMA-DELTA MODULATOR, IEEE Conference on Application Specific Integrated Circuits, September 1998, with D.T. McGrath and J.T. Tiemann.
COMPARISON OF DUAL-DAMASCENE STRATEGIES FOR COPPER INTERCONNECTS WITH POLYMER IMDs, Advanced Metallization Conference, October 1998, with D.T. Price.
CHEMICAL-MECHANICAL PLANARIZATION OF BCB AND SILK LOW-K POLYMER INTERLEVEL DIELECTRICS IN COPPER SLURRIES, 1999 CMP-MIC, February 1999, with C. Borst and W. Gill, invited.
COPPER/BCB INTERCONNECTS: ELIMINATION OF HIGH RESISTIVITY METALLIC LINERS FOR SEALED TECHNOLOGIES, 1999 CMP-MIC, February 1999, with J. Neirynck and S. Murarka.
CHEMICAL-MECHANICAL POLISHING OF ALUMINUM AND COPPER INTERCONNECTS WITH MAGNETIC LINERS AND OXIDE ILD, 1999 CMP-MIC, with B. Wang and T.P. Chow.
CMP ISSUES IN COPPER DAMASCENE PATTERNING, AVS International Conference on Advanced Materials and Processes for Microelectronics, March 1999, invited.
BIASED-STRESS INDUCED CHANNEL MOBILITY IMPROVEMENT IN 4H-SIC MOSFETs, Materials Research Society, April 1999, with K. Chatty, T.P Chow, E. Arnold, and D. Alok.
STATIC AND DYNAMIC CHARACTERISTICS OF A 1100V, DOUBLE-IMPLANTED, PLANAR, 4H-SiC PiN RECTIFIER, International Symp. Power Semiconductor Devices and ICs, pp. 137-140, May 1999, with V. Khemka, R. Patel, N. Ramungul, and T.P. Chow.
ELIMINATION OF HIGH RESISTIVITY LINERS FOR SCALED TECHNOLOGIES WITH COPPER AND LOW-K POLYMERS, IEEE Interconnect Conference, June 1999, with Y. Xiao, J. Neirynck and S.P. Murarka.
HIGH VOLTAGE LATERAL RESURF MOSFETs, Device Research Conference, June 1999, with K. Chatty, S. Banerjee, T.P. Chow, and M. Hoshi.
CHARACTERISTICS OF NICKEL SCHOTTKY JUNCTIONS ON TRENCH SIDEWALLS OF REACTIVE ION ETCHED 4H-SiC SURFACES, Electronics Materials Conference, June 1999, with V. Khemka and T.P. Chow.
CMP OF LOW-K POLYMERS IN COPPER SLURRIES, Topical CMP Conference, August 1999, with C.L. Borst, Y. Xiao and W.N. Gill, invited.
INTERCONNECT TECHNOLOGY AND DESIGN IMPLICATIONS ON ASIC AND SYSTEM-ON-A-CHIP (SOC) IMPLEMENTATIONS, IEEE Advanced Semiconductor Manufacturing Conference, September 1999, with K. Chan and R.J. Graves.
CMP OF LOW-K DIELECTRICS, 1999 VLSI Multilevel Interconnect Conference (VMIC), September 1999, with C.L. Borst and W.N. Gill, invited.
BREAKDOWN VOLTAGE IMPROVEMENT OF 4H-SiC SCHOTTKY DIODES WITH A THIN SURFACE IMPLANT, International Conference on Silicon Carbide and Related Materials, with V. Khemka, K. Chatty, and T.P. Chow.
NITROGEN- AND PHOSPHORUS-IMPLANTED, HIGH-VOLTAGE PLANAR 4H-Sic JUNCTION RECTIFIERS, International Conference on Silicon Carbide and Related Materials, October 1999, with K. Chatty, V. Khemka, and T.P. Chow.
HIGH VOLTAGE LATERAL REESURF MOSFETs ON 4H-Sic USING NITROGEN AND PHOSPHORUS AS IMPLANTS, International Conference on Silicon Carbide and Related Materials, October 1999, with K. Chatty, S. Banerjee, and T.P.Chow.
DAMASCENE PATTERNING OF ADVANCED INTERCONNECT STRUCTURES, Advanced Vacuum Society Conference, October 1999, invited.
CHEMICAL-MECHANICAL PLANARIZATION ISSUES IN PATTERNING COPPER AND ALUMINUM INTERCONNECTS WITH MAGNETIC LINERS, Electrochemical Society, October 1999, with B. Wang, B-C. Lee, T.P. Chow, and D.J. Duquette, invited.
MICROSTRUCTURAL CHARACTERIZATION OF ANTIMONIDE-BASED III-V COMPOUNDS AND THEIR EFFECT ON ELECTRO-OPTICAL PROPERTIES OF SUBSTRATE MATERIALS AND DEVICES, Materials Research Society, December 1999, with P.S. Dutta, G.W. Charache, and C.A. Wang, invited.
ATOMICALLY FLAT SURFACES OF COMPOUND SEMICONDUCTORS BY CHEMICAL-MECHANICAL POLISHING, 2000 CMP-MIC, February 2000, with P.S. Dutta, invited.
FUNDAMENTAL MECHANISMS IN METAL CMP USING MODEL SLURRIES, 2000 CMP-MIC, February 2000, with B-C. Lee, B. Wang, and D.J. Duquette, invited.
A NOVEL SINGLE STEP LAPPING AND CHEMO-MECHANICAL POLISHING SCHEME FOR ANTIMOIDE BASED SEMICONDUCTORS USING AGGLOMERATE-FREE ALUMINA SLURRY, Materials Research Society, March 2000.
NON-CONTACTING CHARACTERIZATION OF RECOMBINATION PROCESSES IN 4H-SIC, Materials Research Society, March 2000, with K. Matocha and T.P. Chow.
CONSUMABLES FOR CHEMICAL MECHANICAL PLANARIZATION, American Ceramic Society, International Conference, May 2000, invited.
IMPROVED IMPLANTED RESURF MOSFETS IN 4H-SIC, Device Research Conference, 2000, with S. Banerjee, K. Chatty, and T. P. Chow.
EFFECT OF IMPLANT ANNEAL AND OXIDATION CONDITIONS ON NITROGEN AND PHOSPHORUS IMPLANTED 4H-SIC MOSFETS, Electronics Materials Conference, 2000, with S. Banerjee, K. Chatty, and T.P. Chow
DESIGN AND IMPLEMENTATION OF RESURF MOSFETS IN 4H-SIC, European Conference on SiC and Related Materials, 2000, with S. Banerjee, K. Chatty, and T.P. Chow.
CHEMICAL-MECHANICAL POLISHING OF COPPER SILK IN MODEL ALUMINA SLURRIES: EXPERIMENTAL AND MODELING RESULTS, 17th VMIC Conference, June 2000, pr. 123-132 with C.L. Borst, B.-C. Lee, D.G. Thakurta, D.J. Duquette, and W.N. Gill, invited.
MULTIPLEXED LOCAL AREA NETWORK INTERCONNECT TOPOLOGIES: DESIGN CONCEPTS FOR THE POST COPPER/LOW-K DECADE, 17th VMIC Conference, June 2000, with J.Q. Lu, invited.
CHEMICAL-MECHANICAL POLISHING OF COPPER AND SILK IN MODEL ALUMINA SLURRIES: EXPERIMENTAL AND MODELING RESULTS, VMIC, invited paper with C.L. Borst, B.C. Lee, D.G. Thakurta, D.J. Duquette, and W.N. Gill.
THE CHEMICAL-MECHANICAL POLISHING OF COPPER WITH MODEL SLURRIES, The 198th Electrochemical Society Meeting, with B.C. Lee, and D.J. Duquette, invited.
SYNTHESIS OF ALUMINA SLURRIES FOR DAMASCENE PATTERNING OF COPPER, MRS Conf., March 2000, accepted with B.C. Lee, and D.J. Duquette, invited.
3D INTEGRATION USING NOVEL WAFER BONDING TECHNIQUES, Advanced Metallization
Conference, Oct. 2000, with J.-Q. Lu, A. Kumar, Y. Kwon,
R.P. Kraft, J.F. McDonald, T.S. Cale, T.-M. Lu, P. Belemigian, O. Erdogan,
A. Kayloyeros, J. Castracane, and E. Eisenbraun.
NITROGEN VS. PHOSPHORUS AS IMPLANT SPECIES FOR HIGH-VOLTAGE RESURF MOSFETS IN 4H-SIC, Materials Science Forum, 2000, with K. Chatty, S. Banerjee, and T.P Chow.
COMPARISON OF NITROGEN AND PHOSPHORUS IMPLANTED JUNCTION RECTIFIERS IN 4H-SIC, Materials Science Forum, 2000, with K. Chatty, V. Khemka, and T.P. Chow.
BREAKDOWN VOLTAGE IMPROVEMENT OF 4H-SIC SCHOTTKY DIODES BY A THIN SURFACE IMPLANT, Materials Science Forum, 2000, with V. Khemka, K. Chatty, and T.P. Chow.
CHEMICAL-MECHANICAL PLANARIZATION OF LOW-K POLYMERS FOR ADVANCED IC STRUCTURES, Polymer Material Workshop, December 2000, with C.L. Borst, D.G. Thakurta, and W.N. Gill, invited.
A NOVEL SINGLE STEP LAPPING AND CHEMO-MECHANICAL POLISHING SCHEME FOR ANTIMONIDE BASED SEMICONDUCTORS USING AGGLOMERATE-FREE ALUMINA SLURRY, Materials Research Society Proceeding, 2001, with P.S. Dutta, D. Keller, and L. Sweet.
CHEMICAL-MECHANICAL POLISHING AND ATOMIC FORCE MICROSCOPIC STUDY OF SILICON CARBIDE SUBSTRATES, Materials Research Society Proceedings, 2001, with P.S. Dutta, and T.P. Chow.
NON-CONTACTING CHARACTERIZATION OF RECOMBINATION PROCESSES IN 4H-SiC, Materials Research Society Proceedings, 2001, with K. Matocha and T.P.Chow.
MECHANISTIC UNDERSTANDING OF THE CMP OF METALS, DIELECTRICS AND SEMICONDUCTORS: WHATS KNOWN AND WHATS NOT, 6th International Chemical-Mechanical planarization for ULSI Multilevel Interconnect Conference, invited, CMP-MIC, March 2001, 81-90, with D.J. Duquette, P.S. Dutta, and W.N. Gill.
HALL MEASUREMENTS ON INVERSION AND ACCUMULATION-MODE 4H-SiC MOSFETs, International Conference on SiC and Related Materials, Paper MoB2-4, p.293, with K.Chatty, S. Banerjee, T.P. Chow, E. Arnold, and D. Alok.
GALLIUM NITRIDE METAL-INSULATOR-SEMICONDUCTOR CHEMICAL VAPOR DEPOSITED OXIDES, International Conference on SiC and Related Materials, Paper WeP-26, p.404, with K. Matocha, and T.P. Chow.
HYSTERSIS IN TRANSFER CHARACTERISTICS IN 4H-SiC DEPLETION/ACCUMULATION-MODE MOSFETs, International Conference on SiC and Related Materials, Paper ThP-18, p.598, with K. Chatty, S. Banerjee, and T.P. Chow.
GALLIUM NITRIDE POWER DEVICE DESIGN TRADEOFFS, International Conference on SiC and Related Materials, Paper FrA1-3, p.685 with K. Matocha, and T.P. Chow.
IP CORE-BASED DESIGN, HIGH-SPEED PROCESSOR DESIGN AND MULTIPLEXING LAN ARCHITECTURES ENABLED BY 3D WAFER BONDING TECHNOLOGIES, in CD of DesignCon 2001: Wireless and Optical Broadband Design Conference, paper#: WB-13, February 2001, Santa Clara, CA with J.-Q. Lu, R.P. Kraft, P.M. Belemjian, O. Erdogan, J. Barrett, and J.F. McDonald.
STACKED CHIP-TO-CHIP INTERCONNECTIONS USING WAFER BONDING TECHNOLOGY WITH DIELECTRIC BONDING GLUES, in Proceedings of the 2001 IEEE International Interconnect Technology Conference (IITC), pp. 219-221, June 2001, with J.-Q. Lu, Y. Kwon, R.P. Kraft, J.F. McDonald, and T.S.Cale.
FLIP-CHIP FLEX CIRCUIT PACKAGING FOR POWER ELECTRONICS, Proc. Of International Symposium on Power Semiconductor Devices & ICs, Osaka, Japan, pp. 55-58, 2001, with Y. Xiao, R. Natarajan, P. Jain, J. Barrett, G. Rymaszewski, and T.P. Chow.
200 MM WAFER BONDING FOR 3-D INTERCONNECTS USING LOW-K DIELECTRICS AS BONDING GLUE, in Seventh International Conference on Dielectrics and Conductors for ULSI Multilevel Interconnection (DCMIC), pp. 56-59, March 5, 2001, Santa Clara, CA, with J.-Q. Lu, Y. Kwon, R.P. Kraft, J.F. McDonald, and T.S. Cale.
DESIGN AND FABRICATION OF DAMASCENE PATTERNED INTERCONNECTIONS FOR FACE-TO-FACE WAFER BONDED 3D-STACKED IC TEST STRUCTURES, 18th International VLSI Multilevel Interconnection (VMIC) Conference, Sept. 2001, invited with J.-Q Lu, R.P. Kraft, O. Erdogan, Y. Kwon, P. Belemjian, G. Rajagopalan, M. Gupta, J.M. McMahon, J. Mayega, D.-L. Bae, C.K. Hong, T.S. Cale, invited.
THREE-DIMENSIONAL WAFER-SCALE INTEGRATION: WHAT, WHEN, WHY, AND THE IMPACT ON THE IC/FIRST-LEVEL PACKAGE INTERFACE, in Proceedings of 2002 AVS Third International Conference on Microelectronics and Interfaces (ICMI'02), pp. 23-26, Ed. C.T. Gabiel, Santa Clara, CA, Feb. 11-14, 2002. (Invited), with J.-Q. Lu and T.S. Cale.
PLANARIZATION YIELD LIMITERS FOR WAFER-SCALE 3D ICS, at 13th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (ASMC'02), Boston, MA, April 30 - May 2, 2002 with M. Gupta, G. Rajagopalan, C.K. Hong, J.-Q. Lu, and K. Rose.
ROBUST, 1000V, 130 MILIHM-CM1, LATERAL TWO-ZONE RESURF MOSFETS IN 6H-SIC, ISPSD02, Sante Fe, NM. June 4-7, 2002, S. Banerjee, and T. P.Chow.
A WAFER-SCALE 3D IC TECHNOLOGY PLATFORM USING DIELECTRIC BONDING GLUES AND COPPER DAMASCENE PATTERNED INTER-WAFER INTERCONNECTS, in Proceedings of 2002 IEEE International Interconnect Technology Conference (IITC), pp. 78-80, San Francisco, CA, June 3-5, 2002 with J.-Q. Lu, Y. Kwon, G. Rajagopalan, M. Gupta, J. McMahon, K.-W. Lee, R.P. Kraft, J. F. McDonald, T.S. Cale, B. Xu, E. Eisenbraun, J. Castracane, and A. Kaloyeros.
CMP NEEDS FOR 3D ICS USING BONDING GLUES AND CU INTERCONNECTS: TECHNOLOGY ISSUES AND FIRST GENERATION RESULTS, in CAMP's Seventh International Symposium on Chemical-Mechanical Polishing (CMP), Hilton Resort, Lake Placid, NY, August 11 - 14, 2002, with A. Jindal, M. Gupta, G. Rajagopalan, J.-Q. Lu, and K. Rose.
COMPARISON OF 1KV LATERAL RESURF MOSFETS IN 4H-SIC AND 6H-SIC, European Conference on Silicon Carbide and Related Materials (ECSCRM02), Stockholm, Sweden, Sept. 1-5, 2002, with S. Banerjee, and T. P. Chow.
PROCESSING OF INTER-WAFER VERTICAL INTERCONNECTS IN 3D ICS, at Advanced Metallization Conference in 2002 (AMC 2002), San Diego, CA, Oct. 1-3, 2002 with J.-Q. Lu, K.W. Lee, Y. Kwon, G. Rajagopalan, J. McMahon, B. Altemus, M. Gupta, E. Eisenbraun, B. Xu, A. Jindal, R.P. Kraft, J.F. McDonald, J. Castracane, T.S. Cale, and A. Kaloyeros.
WAFER BONDING USING LOW-K DIELECTRICS AS BONDING GLUE IN THREE-DIMENSIONAL INTEGRATION, in Sixth International Symposium on Semiconductor Wafer Bonding: Science, Technology, in ECS/ISE 2001 meeting, San Francisco, CA, September 2001, with Y. Kwon, J.-Q. Lu, R.P. Kraft, J.F. McDonald and T.S. Cale.
THREE-DIMENSIONAL (3D) ICs: A TECHNOLOGY PLATFORM FOR USING DIELECTRIC BONDING ON 200 MM WAFERS, to be published in Materials Research Society Digest in 2002, with J.-Q Lu, Y. Kwon, G. Rajagopalan, M. Gupta, D.-L Bae, J. McMahon, C.K. Hong, R.P. Kraft, O. Erdogan, P.M Belemjian, J.F. McDonald, T.S. Cale, e. Eisenbraun, B. Xu, J. Castracane, and A. Kayloeros.
THREE-DIMENSIONAL WAFER-SCALE INTEGRATION: WHAT, WHEN, WHY AND THE IMPACT ON THE IC/FIRST-LEVEL PACKAGE INTERFACE, (invited) AVS Third International Conference on Microelectronics and Interfaces (ICMI) Santa Clara, CA, Feb. 2002, with J.-Q. Lu, and T.S. Cale, invited.