Center for Advanced Interconnect Systems Technologies
Supported by SRC (Semiconductor Research
Corporation), New York State, and IBM. SRC funding
comes from semiconductor industry manufactures and their suppliers.

Overview

  • Electron Scattering at Cu-interconnect Surfaces - Daniel Gall and Hong Guo
  • Novel pore sealing techniques for ultra-low K materials - T.-M. Lu, H. Bakhru.
  • Direct Electrodeposition of Copper on Metallic (Ta, Ru) and Non-Metallic (TaN x, TiN) Barrier Layers - D. J. Duquette


 

Center for Integrated Electronics
Rensselaer Polytechnic Institute
Troy, New York 12180

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