for Advanced Interconnect Systems Technologies
Supported by SRC (Semiconductor
Corporation), New York State, and IBM. SRC funding
comes from semiconductor industry manufactures and their suppliers.
- Electron Scattering at Cu-interconnect Surfaces - Daniel Gall and Hong Guo
- Novel pore sealing techniques for ultra-low K materials - T.-M. Lu, H. Bakhru.
- Direct Electrodeposition of Copper on Metallic (Ta, Ru) and Non-Metallic (TaN x, TiN) Barrier Layers - D. J. Duquette