CAIST: Our work on microelectronics is being done in the framework of our new Center for Advanced Interconnect Science and Technology. This interdisciplinary center is housed at RPI and includes investigators from various engineering disciplines, chemistry, physics, and materials science and mathematics. This new Center has existed for one year and has grown out of a smaller 8-year effort. The following topics are being studied:
(1) Experiments and Models on Chemical Vapor Deposition of Copper Films Using Organometallic Precursors in thermal and plasma CVD Systems.
(2) Kinetics of Chemical Vapor Deposition of Dielectric Films (SiO2) by Decomposition of Organic (TEOS) Precursors: Models and Experiments.
(3) Spin-On Aerogels For Deep Sub-Micron Devices (with J. Plawsky and P. Wayner).
(4) CVD of Low Dielectric Constant Polymer Films: Models and Experiments.
(5) Modeling And Simulation Of Conformal Deposition, Structure And Properties Of Thin Films In Microelectronic Devices: (A proposed interdisciplinary program involving nine professors from Chemical, Civil, Mechanical Engineering, Materials Science, Computer Science and Mathematics).
(6) Chemical Mechanical Polishing (CMP) of Thin Films with S. Murarka).
(7) Pulsed electroplating of copper for microelectronic devices.
(1) Recycle and Purification of Integrated Circuit Etching Solutions
by Membrane Separations.
(2) Development and Demonstration of Hybrid Membrane-Adsorption Systems for Hazardous Waste Reduction in Metals Finishing Industry with S. Cramer.
(1) Polymer to Ceramic Composite Pyroloysis.