Publications

William Gill

Recent Publications

Saxena, R., D.G. Thakurta, R.J. Gutmann, W.N. Gill, "A feature Scale Model for Chemical Mechanical Planarization of Damascene Structures", Thin Solid Films, 449/1-2, 192-206 (2003). Plawsky, J.L., W.N. Gill, A. Jain, S. Rogojevic, "Nanoporous dielectric films: fundamental property relations and microelectronics applications" Chapter 9 in Book Interlayer Dielectrics for Semiconductor Technologies, Eds. Murarka, Eizenberg and Sinha, Elsevier, 261-325 (2003). Gill, W.N., S. Rogojevic and T-M. Lu, "Vapor Deposition of Low-K Polymeric Dielectrics", Chapter in Book Low Dielectric Constant Materials for IC Applications, Eds. P.S. Ho, W.W. Lee and J. Leu, Springer Verlag 95 - 119 (2003). Borst, C.L., W.N. Gill and R.J. Gutmann, "Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses, Fundamental Mechanisms and Application to IC Interconnect Technology"229 page Book, Kluwer Academic Publishers, Boston (2002). Rogojevic,S., A. Jain, W.N.Gill and J. L. Plawsky, "Moisture Adsorption in Nanoporous Silica Xerogels" Journal of Electrochemical and Solid State Letters, 5, F22-F23, 2002. Rogojevic, S., A. Jain, W.N. Gill and J. L. Plawsky, "Interactions Between Nanoporous Silica and Copper", Journal of Electrochemical Society, 149(9), F122-130 (2002). Plawsky, J. L., F. Wang and W.N. Gill, "A Reaction Kinetic Model for the Pyrolysis of Polysiloxane Polymers to Form Ceramic Composites", AIChE Journal, 48(10), pp 2314-2322, October (2002). Thakurta, D. G., D. W. Schwendeman, R. J. Gutmann, S. Shankar, L. Jiang and W.N. Gill, "Three-Dimensional Wafer-Scale Copper Chemical-Mechanical Planarization Model", Thin Solid Films, 414, 78 - 90 (2002) Borst, C. L., D. G. Thakurta, W. N. Gill and R. J. Gutmann, "Surface Kinetics Model for SiLK Chemical-Mechanical Polishing", Journal of Electrochemical Society, 149, G118-G130 (2002). Jain, A., S. Rogojevic, S. Ponoth, W. N. Gill, J. L. Plawsky, "Processing Dependent Thermal Conductivity in Nanoporous Silica Xerogel Films", Journal of Applied Phiysics, 91(5), 3275-3281 (2002). Borst, C. L., D. G. Thakurta, W. N. Gill, R. J. Gutmann, "Chemical-Mechanical Planarization of Low-K Polymers", ASME - Journal of Electronic Packaging, 124(4), 362-366 (2002). Jain, A., S. Rogojevic, F. Wang, W.N. Gill, P.C. Wayner, Jr., J.L. Plawsky, A. Haberl and W. Lanford, "Processing, Characterization and Reliability of Silica Xerogel Films for Interlayer Dielectric Applications", Mater. Res. Soc. Symp. Proc., 612, D5.25/1-D5.25/6 (2001). Jain, A., S. Rogojevic, S. Ponoth, N. Agarwal, I. Matthew, W. N. Gill, P. Persans, M. Tomozawa, J. L. Plawsky, and E. Simonyi, "Porous Silica Materials as Low-k Dielectrics for Electronic and Optical Interconnects", Thin Solid Films, 398, 513-522 (2001). Jain, A., S. Rogojevic, W.N. Gill, and J. L. Plawsky, "The Effects of Processing History on the Modulus of Silica Xerogel Films", Journal of Applied Physics, 90(11), 5832-5834 (2001). Rogojevic, S., A. Jain, F. Wang, W. N. Gill, P. C. Wayner, Jr., and J. L. Plawsky, "Interactions Between Silica Xerogel and Tantalum", Journal of Vacuum Science and Technology, B19(2), 354-360 (2001). Borst, C. L., V. Korthuis, G. B. Shinn, J. D. Luttmer, R. J. Gutmann, and W. N. Gill, "A Novel Mechanism for the Chemical-Mechanical Polishing of SiOC Organosilicate Glasses: The Effect of Film Carbon Content", Thin Solid Films, 385, 281-292 (2001). Thakurta, D. G., C. L. Borst, D. W. Schwendeman, R. J. Gutmann, and W. N. Gill, "Three-dimensional Chemical-Mechanical Planarization Slurry Flow Model Based on Lubrication Theory", Journal of Electrochemical Society, 148 (4) G207-214 (2001). Wang, F., T. Apple and W. N. Gill, "Redistribution Reactions of BlackglasTM Ceramic", Journal of Applied Polymer Science, 81 (1), 143-152 (2001). Gill, W. N., D. J. Duquette and D. Varadarajan, "Mass Transfer Models for the Electrodeposition of Copper with a Buffering Agent", Journal of Electrochemical Society, 148 (4) C289-296 (2001). Gutmann, R. J., D. J. Duquette, P. S. Dutta, and W.N. Gill, "Mechanistic Understanding of the CMP of Metals, Dielectrics and Semiconductors: What's Known and What's Not", 6th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnect Conference, Invited, CMP - MIC, March 2001, 81-90. Standaert, T. E. F. M., E. A. Joseph, G. S. Oehrlein, A. Jain, W. N. Gill, P. C. Wayner and J. L. Plawsky, "Etching of Xerogel in High-Density Fluorocarbon Plasmas", Journal of Vacuum Science and Technology, 18 (6) 2742 - 2748, (2000). Hu, C., M. Morgen, P.S. Ho, A. Jain, W.N. Gill, J.L. Plawsky, and P.C. Wayner, Jr., "Thermal Conductivity Study of Porous low-k Dielectric Materials", Applied Physics Letters, 77(1), 145 (2000). Wang, F., W. N. Gill, C. A. Kirk, and T. Apple, "NMR Characterization of Postcure Temperature Effects on the Microstructures of BlackglasTM Resin and Ceramic", Journal of NonCrystalline Solids, 275 (3) 210-215 (2000). Varadarajan, D., C.Y. Lee, A. Krishnamoorthy, D. J. Duquette and W.N. Gill, "A Tertiary Current Distribution Model for the Pulse Plating of Copper into High Aspect Ratio sub-0.25 m Trenches", Journal of the Electrochemical Society, 147 (9) 3382-3392 (2000). Borst, C.L., W.N. Gill and R.J. Gutmann, "Chemical-Mechanical Planarization of BCB and SiLK Low-k Polymer Interlevel Dielectric in Copper Slurries", International Journal of Chemical-Mechanical Planarization for On-Chip Interconnection", 1(1), 26-35 (2000). Thakurta, D.G., C.L. Borst, D.W. Schwendeman, R.J. Gutmann, and W.N. Gill, "Pad Porosity, Compressibility and Slurry Delivery Effects in Chemical-Mechanical Planariztion: Modeling and Experiments", Thin Solid Films, 366(1-2), 181-190 (2000). Lakshmanan, S.K. and W.N. Gill, "A New Feature Scale Model and Experiments of the Hydrogen Plasma Assisted Chemical Vapor Deposition of Copper", Chemical Engineering Communications, 182, 99-12 (2000). Varadarajan, D., C. Y. Lee, D. J. Duquette and W. N. Gill, "A Mass Transfer Model for the Pulse Plating of Copper into High Aspect Ratio Sub-0.25 m Trenches", Electrolytic processes in VLSI Fabrication and Semiconductor Metal Deposition II, Editors P. Andricocas et.al, Electrochemical Society, Pennington, N.J., 2000, pg. 61-66. Gutmann, R.J., C.L. Borst, B.-C. Lee, D.G. Thakurta, D.J. Duquette and W.N. Gill, "Chemical-Mechanical Polishing of Copper and Silk in Model Alumina Slurries: Experimental and Modeling Results", Proceedings 17th VLSI Multilevel Interconnection Conference (VMIC), June 26-30, 123-134 (2000). Jain, A., S. Rogojevic, F. Wang, W.N. Gill, P.C. Wayner, Jr., and J.L. Plawsky, "Processing, Characterization and Reliability of Silica Xerogel Films for Interlayer Dielectric Applications", Proceedings of Materials Research Society, Vol. 612, D5.25.1 (2000). Thakurta, D.G., C.L. Borst, D.W. Schwendeman, R.J. Gutmann, and W.N. Gill, "Pad Porosity, Compressibility and Slurry Delivery Effects in Chemical-Mechanical Planariztion:  Modeling and Experiments", Thin Solid Films, In Press (1999).

Borst, C.L., R.J. Gutmann, and W.N. Gill, "Mechanisms for Chemical-Mechanical polishing of Low Dielectric Constant Polymers in Copper Slurries", V-MIC Conference Digest, Accepted (1999).

Borst, C.L., W.N. Gill and R.J. Gutmann, "Chemical-Mechanical Planarization of BCB and SiLK Low-k Polymer Interlevel Dielectric in Copper Slurries", International Journal of Chemical-Mechanical Planarization for On-Chip Interconnection",  In Press (1999).

Lakshmanan, S.K. and W.N. Gill, "A New Feature Scale Model and Experiments of the Hydrogen Plasma Assisted Chemical Vapor Deposition of  Copper", Chemical Engineering Communications,  In Press (1999).

Gill, W.N., S. Rogojevic and T-M. Lu, "Vapor Deposition of Low-K Polymeric Dielectrics" - Chapter in Low Dielectric Constant Materials for IC Applications, Eds. P.S. Ho, W.W. Lee and J. Leu, Springer Verlag, In Press (1999).

Jain, A., S. Rogojevic, S. Nitta, V. Pusapatti,W.N. Gill, P.C. Wayner, J.L. Plawsky, T.E. Standaert, G.S. Oehrlein, "Processing and Characterization of Silica Xerogel Films for Low-K Dielectric Applications", MRS Proceedings, Vol. 565, 29-40(1999).

Hu, C., Morgen, M., Ho, P.S., Jain, A., Gill, W.N., Plawsky, J.L., and P.C. Wayner, Jr., "Thermal Conductivity Study of Porous Low K Dielectric Materials", MRS Proceedings, Vol. 565, 87-92 (1999).

Borst, C.L., W.N. Gill, and R.J. Gutmann, "Chemical-Mechanical Planarization of BCB and Silk Low-K Polymer Interlevel Dielectrics in Copper Slurries", Fourth International CMP-MIC Proceedings, Catalog 99IMIC-400P, 409-412, Library Congress No. 89-644090, Feb. (1999).

Borst, C.L., D.G. Thakurta, W.N. Gill, and R.J. Gutmann, "Chemical-Mechanical Polishing Mechanisms of Low Dielectric Constant Polymers in Copper Slurries", Journal of the Electrochemical Society, 146, 4309-4315 (1999).

Nitta, S.V., A. Jain, P.C. Wayner, Jr., W.N. Gill and J.L. Plawsky, "The Effect of Sol Rheology on the Uniformity of Spin-On Silica Xerogel Films", Journal of Applied Physics, 86, 5870-5878 (1999).

Nitta, S.V., V. Pisupatti, A. Jain, P.C. Wayner, W.N. Gill and J.L. Plawsky, "Surface Modified Spin-on Xerogel Films as Interlayer Dielectrics" Journal of Vacuum Science and Technology,  B17 (1), 205-212 (1999).

Lanford, W.A., S. Bedell, P. Isberg, B. Hjorvarsson, S.K. Lakshmanan and W.N. Gill, "Low Temperature Transport of Al Into and Through Copper Starting with Cu/Al/SiO2 bilayers", Journal of Applied Physics, 85 (3), 1487-1495 (1999).

Rogojevic, S., J.A. Moore and W.N. Gill, "Modeling Vapor Deposition of Low-K Polymers:  Parylene and Polynapthalene", Journal of Vacuum Science and Technology, Jan/Feb. A17 (1), 266-274 (1999).

Sundararajan, S., D.G. Thakurta, D.W. Schwendeman, S.P. Murarka, and W.N. Gill, "Two-Dimensional Wafer-Scale Chemical Mechanical Planarization Models Based on Lubrication Theory and Mass Transport", Journal Electrochemical Society, 146 (2), 761-766 (1999).

Lakshmanan, S., W.N.Gill, "A Novel Model of Hydrogen Plasma Assisted Chemical Vapor Deposition of Copper", Thin Solid Films, 38, (1,2), 24-39 (1999).

E. J. Kim and W.N. Gill, “Modeling of SiO2  CVD from TEOS/Ozone in a Separate-Gas-Injection Reactor”, Korean J. Chem. Eng., 15(1), 56-63 (1998).

S. Nitta, A. Jain, V. Pisupatti, W.N. Gill, P.C. Wayner, Jr., and J.L. Plawsky, "Fabrication and Characterization of Spin-On Silica Xerogel Films", MRS Symposium Proceedings, 511, 99-104 (1998).

H. Bakhru, A. Kumar, T. Kaplan, M. DeLarosa, J. Fortin, G.-R. Yang, T.-M. Lu, S. Kim, C. Steinbruchel, X. Tang, J.A. Moore, B. Wang, J. McDonald, S. Nitta, V. Pisupatti, A. Jain, P. Wayner, J. Plawsky, W. Gill and C. Jin, "Ion Beam Techniques for Low K Materials Characterization", MRS Symposium Proceedings, 511, 125-131 (1998).

Gill, W.N., V. Agrawal, A.L. Gill, M. Naik, A. Kulkarni, and D. Murkerjee, "Novel Membrane-Based Systems for Reprocessing Hydrofluoric Acid Etching Wastes", Advances in Environmental Research, 2 (3), 333-350, (1998).

Naik, M. B., S. K. Lakshmanan, R. H. Wentorf, R. R. Reeves and W. N. Gill, "Thermal Chemical Vapor Deposition of Copper from Hexafluoroacetylacetonate Cu(I) Vinyltrimethylsilane:  Kinetic Studies", Journal of Crystal Growth, 193 (1-2) 133-147, (1998).

Lakshmanan, S. and W. N. Gill, "Experiments on the Plasma Assisted Chemical Vapor Deposition of Copper", Journal of Vacuum Science and Technology, A16 (4), 2187-2197, July/Aug. (1998).

Goel, M., A. Kulkarni, S. M. Cramer, V. Agrawal and W. N. Gill, "Stability and Transport Characteristics of Reverse Osmosis Membranes Using Cyanide Rinse Waters", Journal Membrane Sci., 141, 245-254 (1998).

Yang, G.R., Ganguli, S., Karcz, J., Gill, W.N., and Lu, T-M., "High Deposition Rate Parylene Films", Journal of Crystal Growth, 183, 385-390(1998).

Lakshmanan, S. and W. N. Gill, "Comparison of Experiment with a Lumped Parameter Model of Plasma Assisted Chemical  Vapor Deposition of Cooper, Journal Electrochemical Society, 145, (2), 694 - 700, Feb. (1998).

Ganguli, S., Agrawal, H., Wang, B., McDonald, J.F., Lu, T-M., Yang, G-R., and Gill, W.N., "Improved Growth and Thermal Stability of Parylene Films", Journal of Vacuum Science and Technology, A15 (6) 3138-3142, Nov./Dec. (1997).

Gill, W.N., Kulkarni, A., Wang, F., and Lee, Y.W., "Development of Mechanistic Model for BlackglasTM Pyrolysis:  Comparison of Theory and Experiment" Ceramic Engineering and Science Proceedings, 18 (4) 407-415 (1997).

Ananth, R., and Gill, W.N., "Dendritic Growth in Microgravity and Forced Convection", Journal of Crystal Growth, 179 (1,2), 263-276 (1997).

Gill, W.N., and Ganguli, S., "Gas Phase and Surface Reactions in Sub-atmospheric Chemical Vapor Deposition of TEOS-Ozone", Journal of Vacuum Science and Technology, B15 (4), 948-954, July/Aug. (1997).

Gutmann, R.J., Gill, W.N., Lu, T-M., McDonald, J.F., Murarka, S.P., and Rymaszewski, E., "Low and High Dielectric Constant Thin-Films for Integrated Circuit Applications", "Advanced Metallization and Interconnect Systems for ULSI Applications", Materials Research Society Symposium Proceedings, 393-400 (1997).  Eds. R. Havemann, J. Schmitz, H. Komiyama, K. Tsubouchi.

Annamalai, J., Gill, W.N., Tobin, A., Madsen, J. and Donnellan, T.M., "Pyrolysis Behavior of Blackglas Composites", Ceramic Engineering and Science Proceedings, 17 (4), 401-410, (1996).

Buragohain, P.V., Gill, W.N., and Cramer, S.M., "Novel Resin Based Ultrapurification System for Reprocessing IPA in the Semiconductor Industry", Industrial & Engineering Chemistry Research, 35, 3149-54 (1996).

Lee, Y.W., Ananth, R., and Gill, W.N., "Preparation of Ultra-Pure Succinonitrile Countercurrent Distillation for Crystal Growth", Chemical Engineering Communications, 41-52, (1996).

Lee, Y.T., Mukherjee, D., Kulkarni, A., and Gill, W.N., "Multicomponent Transport of Electrolytes through Cellulose Acetate Membranes", Chemical Engineering Communications, 152-153, 53-74 (1996).

Shareef, I.A., Rubloff, G.W., and Gill, W.N., "Role of Gas Phase Reactions in Sub-Atmospheric CVD Ozone/TEOS Processes for Oxide Deposition", Journal of Vacuum Science and Technology, B14 (2), 772-74 (1996).

Kulkarni, A. Mukherjee, D., and Gill, W.N., "Enhanced Transport Properties of Reverse Osmosis Membranes by Chemical Treatment", Journal of Applied Polymer Science, 60, 483-92 (1996).

Kulkarni, A., Mukherjee, D., and Gill, W.N., "Flux Enhancement by Hydrophilization of Thin Film Composite Reverse Osmosis Membranes", Journal of Membrane Science, 114 (1) 39-50 (1996).

Murherjee, D., Kulkarni, A., and Gill, W.N., "Membrane Based System for Ultrapure Hydrofluoric Acid Etching Solutions", Journal of Membrane Science, 109 (2), 205-217 (1996).

Mukherjee, D., Kulkarni, A., and Gill, W.N., "Chemical Treatment for Improved Performance of Reverse Osmosis Membranes", Desalination, 104 (3), 239 (1996).

Soave, R., Ganguli, S., Gill, W.N., Mayer, J., and Shacham-Diamand, Y., "Thickness Profiles of Si02 Films Deposited from Tetraethoxysilane/03 Precursors in Ultra-High-Aspect-Ratio Microstructures", Applied Physics Letters, 67 (22), 3286-3288 (1995).

Ganguli, S., Costello, S.P., and Gill, W.N., "Theory of Free Boundary Step Coverage in Chemical Vapor Deposition", Industrial & Engineering Chemistry Research, ACS, 34 (10), 3380-3391 (1995).

Goel, M., Kulkarni, A., Cramer, S., and Gill, W.N., "Hazardous Source and Waste Reduction in Metals Finishing Industry by Hybrid Membrane Separation Process", ACEE 1995 Summer Study on Energy Efficiency in Industry", II, 617-628 (August, 1995).

Annamalai, J., Gill, W.N., and Tobin, A., "Modeling Analysis and Kinetics of Transformations in Blackglas Preceramic Polymer Pyrolysis", Ceramic Engineering and Science Proceedings, 16, 225-231 (1995).

Kulkarni, A., Murherjee, D., and Gill, W.N., "Membrane Reprocessing of Hydrofluoric Acid Etching Solutions", Semiconductor International, 207-211, July (1995).

Shareef, I.A., Rubloff, G.W., Anderle, M., Gill, W.N., Cotte, J., and Kim, D.H.,  "Sub-Atmospheric CVD (SACVD) Ozone/TEOS Process for Si02 Trench Filling," Journal of Vacuum Science and Technology,  B13, 1888-1892 (1995).

Kim, E.J., and Gill, W.N., "Low Pressure Chemical Vapor Deposition of Silicon Dioxide Films by Thermal Decomposition of Tetra-alkoxysilanes," Journal of Electrochemical Society, 142, 676-682 (1995).

Naik, M.B., Gill, W.N., Wentorf, R.H., and Reeves, R.R., "CVD of Copper by using Copper (I) and Copper (II) b-Diketonates," Thin Solid Films, 262, 60-66 (1995).

Shareef, I., Rubloff, G.W., Anderle, M. Gill, W.N., and Cotte, J., "Reaction Behavior and Deposition Consequences in Conformal CVD by Subatmospheric Ozone/TEOS Process," The Synthesis and Processing of Electronic Materials, AIChE - AVS - IEEE Electronic Devices Society, Nov. 1994, 409-414.

Kulkarni, A., Murkherjee, D., Mukherjee, D., and Gill, W.N., "Reprocessing Hydrofluoric Acid Etching Solutions by Reverse Osmosis," Chemical Engineering Communications, 129, 53-68 (1994).

Mukherjee, D., Kulkarni, A., and Gill, W.N., "Flux Enhancement of Reverse Osmosis Membranes by Chemical Surface Modification," Journal of Membrane Science, 97, 231-249 (1994).

Kim, E.J., and Gill, W.N., "Modeling of CVD of Silicon Dioxide Using TEOS and Ozone in a Single Wafer Reactor," Journal of Electrochemical Society, 141, 3462-3472 (1994).

Mukherjee, D., Kulkarni, A., Chawla, A., and Gill, W.N., "Ultrapurification and Recyling of Hydrofluoric Acid Etching Solutions by Reverse Osmosis," Chemical Engineering Communications, 130, 127-138 (1994).

Gutmann, R.J., Chow, T.P., Gill, W.N., Kaloyeros, A.E., Lanford, W.A., and Murarka, S.P., "Copper Metallization Manufacturing Issues for Future IC's," Materials Research Society Symposium Proceedings, 337, 41-57 (1994).

Kim, E.J., and Gill, W.N., "A New Model for LPCVD of Si02 Films by Ozone Augmented TEOS," Journal of Crystal Growth, 140, 308-314 (1994).

Kim, E.J., and Gill, W.N., "Analytical Model for Chemical Vapor Deposition of Si02 Films Using Tetraethoxysilane and Ozone," Journal of Crystal Growth, 140, 315-326 (1994).

Kim, D.H., Wentorf, R., and Gill, W.N., "Selective Deposition of Copper by CVD Using Cu(HFA)2," Journal of Vacuum Science and Technology, A12, 153-157 (1994).

Kim, D.H., Wentorf, R., and Gill, W.N., "Nucleation of Copper on TiW and TiN During Chemical Vapor Deposition," Journal of Applied Physics, 74, 5164-5166 (1993).

Kim, D.H., Wentorf, R., and Gill, W.N., "Film Growth Kinetics of CVD Copper From Cu(HFA)2," Journal of Electrochemical Society, 140, 3267-3272 (1993).
 
 

Kim, D.H., Wentorf, R., and Gill, W.N., "LPCVD Copper Films for Advanced Device Applications," Journal of Electrochemical. Society, 140, 3273-3278 (1993).

Gill, W.N., "Interactive Dynamics of Convection and Crystal Growth," Division Award Lecture, Journal of Chemical Engineering Education, 27, 198-205 (1993).

Koo, K.K., Ananth, R., and Gill, W.N., "Comments on Surface-Tension Anisotropy Measurements of Succinonitrile and Pivalic Acid:  Comparison with Microscopic Solvability Theory," Physical Review E, 48, 2319-2320 (1993).

Lee, Y.W., Ananth, R., and Gill, W.N., "Selection of a Length Scale in Unconstrained Dendritic Growth with Convection in the Melt," Journal of Crystal Growth, 132, 226-230 (1993).

Lee, Y.W., Gill, W.N., and Ananth, R., "Convective Heat Transfer During Dendritic Crystal Growth," Proceedings of Third World Conference on Experimental Heat Transfer, Fluid Mechanics and Thermodynamics, M. Kelleher, R.K. Shah, K.R. Sreenivasan and Y. Joshi, Eds. Vol. 2, Elsevier Sci. Publishers, Amsterdam, 1696-1700 (1993)

Mellis, R., Gill, W.N., and Belfort, G., "Fluid Dynamics in a Tubular Membrane: Theory and Experiment," Chemical Engineering Communications, 122, 103-125 (1993).

Gill, W.N., Ginde, R.M., and Verhoeven, J., "Surface Tension and Buoyancy Driven Instabilities in a Layer of Tin Heated from Below," Chemical Engineering Communications, 124, 49-57 (1993).

Ananth, R., and Gill, W.N., "Criteria for Making Uniform Films by Chemical Vapor Deposition," Journal of Crystal Growth, 118, 60-70 (1992).

Lee, Y.W., Gill, W.N., and Ananth, R., "Forced Convection Heat Transfer During Dendritic Crystal Growth:  Local Solutions of Navier-Stokes Equations," Chemical Engineering Communications, 116, 193-200 (1992).

Koo, K.K., Ananth, R., and Gill, W.N., "Thermal Convection, Morphological Stability and the Dendritic Growth of Crystals," AIChE Journal, 38, 945-954 (1992).

Gill, W.N., Lee, Y.W., Koo, K.K., and Ananth, R., "Interaction of Thermal and Forced Convection with Growth of Dendritic Crystals," Interactive Dynamics of Convection and Solidification, Kluwer Academic Publishers, Dordrecht, 1992, pp. 93-96.

Kim, D.H., Wentorf, R.H., and Gill, W.N., "Characteristics of Polycrystalline Copper Films Made by CVD from Cu(HFA)2," Materials Research Society Symposium Proceedings, 260, 1992, pp. 107-112.