Rensselaer Catalog
School of Engineering
Materials Science and Engineering

Chair   David J. Duquette
Undergraduate Advising   Minoru Tomozawa
Graduate Recruiting   Roger N. Wright
Graduate Advising   John B. Hudson
Department Home Page   http://www.eng.rpi.edu/dept/materials/

Progress in modern technology is often limited by the availability of suitable solid materials. The materials engineer must produce materials to meet the demands of the designers of jet engines and rocket boosters, microelectronic devices, optical components, medical prostheses, and many other products.

The principles that govern the processing and structure of materials to produce optimum mechanical and physical properties and performance are embodied in the materials engineering curriculum. The program is designed to produce engineers and scientists whose degrees represent useful specialization coupled with a broad background in all classes of materials.

Undergraduate students who wish to extend their education can undertake specialized study in a range of fields, including research in ceramics, polymers, composites, nanostructured materials, high-temperature alloys, solidification, corrosion, deformation processing, welding, high-strength high-modulus materials, biomaterials, electron optics, surface and molecular kinetics, glass science, and the origin of mechanical and physical properties in many different types of materials. Graduate students, in addition to classroom courses, conduct research in a variety of areas described below and write theses based on this research. Extensive laboratories containing modern and sophisticated equipment are available.

For the student who likes to innovate and who wants to apply knowledge to the real problems of a modern technological society, materials science and engineering provides a broad range of exciting opportunities.


Areas of Advanced Research and Study

The major current research thrusts are in materials processing, materials for microelectronic systems, glasses and ceramics, nanostructured materials, and high-performance composite materials. These initiatives are supported by research in materials characterization and properties.

In the materials processing area, major research programs include fundamental studies of solidification process and the effect of solidification under reduced gravity on the formation of dendritic structures, and practically oriented programs in the extrusion processing of aluminum alloys. In the latter program, studies of the complex interactions among stress, strain rate, and temperature during forming processes have made it possible to apply advanced software models to the control of metalworking operations. Studies of powder processing have made possible the extrusion processing of composite materials, while research on joining processes has led to synergistic coupling of adhesive bonding and spot welding technology in automotive sheet metal fabrication. New efforts on the synthesis, processing and properties of nanostructured materials are expanding the capabilities of materials engineering and nanotechnology into areas including ceramics, metals, polymers, composites, and biomaterials. Novel applications of carbon nanotubes for device and chemical applications are being investigated along with chemical, electrical, and mechanical isolation engineering using nanocomposites.

Research in materials for microelectronic systems concentrates on the problems associated with the interconnections between integrated circuit elements. This includes the growth of thin films of metals and both polymer and ceramic dielectric materials, the patterning and etching processes necessary for the fabrication of multilayer devices, and the planarization processes necessary for successful device fabrication. Of special note is our program in microelectronics packaging, which addresses the mechanical, electronic, and thermal aspects of device design and fabrication.

In the glass area, research efforts focus on the factors influencing the useful lifetime of glass components and the effect of environments, especially aqueous environments, on glass failure. In addition to the conventional applications such as windows and bottles, glasses are used as optical components such as optical communication fibers. Specifically, variation of the glass surface structure with time and its influence on glass properties are being investigated. Another emphasis is the development of non-oxide glasses, primarily those based on fluorides, as the transmitting medium in optical fibers for communications purposes.

Composite materials are utilized in industrial and consumer products due to their exceptional stiffness and strength to weight ratios. Applications of composites in the construction industry, such as steel bridge repairs using graphite-epoxy composites, are growing rapidly, while next generation conceptual plans for hybrid electric vehicles call for the use of ceramic composite components for gas turbine engines and thermal recuperators. Composites research activities at Rensselaer include ceramic, metallic, and polymer matrix composites, micromechanics and modeling of both fabrication processes and materials properties, design with new materials, synthesis of new matrix materials, and all aspects of the fabrication and characterization of composites and composite structures. Of special note is the Sailplane Program, in which students have designed, fabricated, and tested an all-composite glider, which has now been flying for over seven years. A new project, the composite hybrid electric vehicle, was initiated two years ago and offers numerous opportunities for both graduate and undergraduate participation.


Faculty

Professors

Duquette, D. J.   Ph.D. (Massachusetts Institute of Technology); environmental and surface effects on the mechanical behavior of metals; corrosion; stress corrosion fatigue; (Department Head).
Glicksman, M.E.   Ph.D. (Rensselaer Polytechnic Institute); melting and solidification; transport properties of liquid metals; phase transformation kinetics; metallurgy of superconductors; (John Tod Horton Professor of Materials Engineering).
Hudson, J.B.   Ph.D. (Rensselaer Polytechnic Institute); adsorption on solid surfaces; structure and reactivity of solids; physics and chemistry of surfaces; nanocrystal growth.
Messler, R.W., Jr.   Ph.D. (Rensselaer Polytechnic Institute); materials in manufacturing; welding.
Moynihan, C.T.   Ph.D. (Princeton University); ionic transport in glass; infrared transmission in glasses and glass ceramics; thermodynamic properties of glasses.
Murarka, S.P.   Ph.D. (University of Minnesota); Ph.D. (University of Agra); metallization for deep submicron silicon integrated circuits; low temperature and localized processes; thin dielectric films; diffusion and defects; (Elaine S. and Jack S. Parker Chair in Engineering).
Rajan, K.   Sc.D. (Massachusetts Institute of Technology); electron microscopy; electronic materials; thin films and superlattices.
Siegel, R.W.   Ph.D. (University of Illinois); synthesis, processing, structure, and properties of functional nanostructured materials, including metals, ceramics, and composites; biomaterials; atomic-scale defects and diffusion in materials; (Robert W. Hunt Professor).
Sternstein, S.S.   Ph.D. (Rensselaer Polytechnic Institute); high-performance composites; physical properties of polymers; rubber elasticity theory; fracture, yielding, and craze formation in glassy polymers and composites; viscoelastic properties; swelling in filled elastomers; (William Weightman Walker Professor of Polymer Engineering).
Tomozawa, M.   Ph.D. (University of Pennsylvania); electrical properties of glasses; X-ray and light scattering; phase separation; mechanical properties of glasses.
Wright, R. N.   Sc.D. (Massachusetts Institute of Technology); metal forming and fabrication; mechanical behavior of metals.

Associate Professors

Ajayan, P.M.   Ph.D. (Northwestern University); synthesis, structure, and properties of carbon-based nanostructures and nanocomposites; phase transitions in nanoscale materials; electron microscopy.
Schadler, L.S.   Ph.D. (University of Pennsylvania); polymer and glass matrix composites; micromechanical behavior; strains and interface properties; micro-Raman spectroscopy; environmental effects.
Steinbruchel, C.   Ph.D. (University of Minnesota); electronic materials; plasma processing; ion beam and ultra-high vacuum techniques.
Assistant Professors
Keblinski, P.   Ph.D. (Pennsylvania State University); atomic and mesoscopic-level computational modeling of interfacial processes, structure-property correlations, interfaces in silicon, diamond and metals, thin film growth, phase separation.
Ramanath, G.   Ph.D. (University of Illinois); thin film electronic materials; interconnects, diffusion barriers, low-k dielectrics; characterization of interfacial reactions, kinetics and mechanisms of microstructure and phase evolution during deposition and annealing; processing self-organized structures for microelectronics applications.

Research Professors

Doremus, R.H.   Ph.D. (University of Cambridge), Ph.D. (University of Illinois); glass science; sintering of ceramics; bone implant materials; reactions in fused salts; crystallization; diffusion; optical properties of metals; (New York State Science and Technology Foundation Professor of Glass and Ceramics Science).
Hillig, W.B.   Ph.D. (University of Michigan); ceramic and polymer matrix composites; strength of glass; crystal growth.
Lupulescu, A.   Research Assistant Professor; Ph.D. (Rensselaer Polytechnic Institute); diffusion, crystal growth.
Rymaszewski, E.J.   Ph.D. (Technical University, Munich); electronic materials; packaging in electronics.

Emeritus Faculty

Chung, C.I.   Ph.D. (Rutgers University); polymer processing; polymer melt rheology; relaxation behavior in polymer solids.
Ficalora, P.J.   Ph.D. (Pennsylvania State University); kinetics and thermodynamics of heterogeneous reactions, chemisorption effects on electronic materials.
Lenel, F.V.   Ph.D. (University of Heidelberg); powder metallurgy technology; mechanisms of sintering; precipitation and dispersion strengthening mechanisms.
MacCrone, R.K.   D.Phil. (University of Oxford); electric properties of polymers and oxides; polarons; electron paramagnetic resonance and magnetic behavior of glasses; phase transformations; nucleation; electrical properties of thin oxide and nitride films; one dimensional conductivity.
Nippes, E.F.   P.E., Ph.D. (Rensselaer Polytechnic Institute); physical metallurgy; welding metallurgy.
Stoloff, N.S.   Ph.D. (Columbia University); mechanical behavior of crystals; order-disorder reactions, fracture; stress corrosion.

Manager of Electron Microscopy Facilities
Dove, R
.

Manager of Instructional Laboratories
Van Steele, D.

Manager of Metallographic Facilities
Gendron, N.


Undergraduate Program

Curriculum   The four-year curriculum for all materials engineering students is as follows:

First Year
Fall Credit Hours
ENGR-1100 Intro. to Engineering Analysis 4
MATH-1010 Calculus I 4
ENGR-1500 Chemistry of Materials I 4
  Hum. or Soc. Sci. Elective 4
Spring Credit Hours
ENGR-1300 Eng. Proc. 1
ENGR-1600 Chemistry of Materials II 4
MATH-1020 Calculus II 4
PHYS-1100 Physics I 4
  Hum. or Soc. Sci. Elective 4
Second Year
Fall Credit Hours
PHYS-1200 Physics II 4
MATH-2400 Intro. to Differential Equations 4
ENGR-2250 Therm/Fluid I 4
  Hum. or Soc. Sci. Elective 4
ENGR-1200 Eng. Graph & CAD 1
Spring Credit Hours
  Science Elective 4
MTLE-2100 Structure of Materials 4
ENGR-2050 Intro. to Engineering Design 4
  Hum. or Soc. Sci. Elective 4
CSCI-1190 Beginning C Programming for Engineers 1
Third Year
Fall Credit Hours
ENGR-2600 Mod./Anal. Uncert. 3
MTLE-4200 Prop. of Eng. Materials I 4
MTLE-4100 Thermo. of Materials 4
  Professional Dev. II (1) 2
  Hum. or Soc. Sci. Elective 4
Spring Credit Hours
MTLE-4250 Prop. of Eng. Materials II 4
MTLE-4150 Kinetics of Materials 4
  Restricted Elective 4
  Free Elective I 4
Fourth Year
Fall Credit Hours
ENGR-4010 Professional Development III (2) 1
MTLE-4910 Design in Materials Eng. 3
MTLE-4400 Materials Syn. & Proc. I 4
  Materials Elective I 3
  Free Elective II 4
Spring Credit Hours
MTLE-4850 Appl. of Matls. 2
MTLE-4450 Materials Syn. & Proc. II 4
  Materials Elective II 3
  Free Elective III 4

1. This course will be fulfilled from a published list at the start of each semester.
2. This course can be taken in either semester of senior year.

The required courses listed above provide the student with a broad background in Materials Science and Engineering with a degree of Bachelor of Science in Materials Engineering.

Restricted Elective Options
ENGR-2530 Strength of Materials
ENGR-2350 Embedded Control
ENGR-2090 Engineering Dynamics
ECSE-4030 Electronic Circuits
ENGR-4300 Electronics Instrumentation
Materials Electives
MTLE-4030 Glass Science
MTLE-4050 Intro. to Polymers
MTLE-4160 Semiconducting Materials
MTLE-4260 High-Temperature Alloys
MTLE-4290 Electronic Packaging
MTLE-4310 Corrosion
MTLE-4410 Welding Processes and Metallurgy
MTLE-4420 Joining of Advanced Materials
MTLE-4630 Composites Laboratory

Minimum Credit Hours   This curriculum requires a minimum of 128 credit hours and completion of the course requirements listed above.

Minor in Materials Science and Engineering   Students not majoring in materials science and engineering may receive a minor in materials science and engineering by completing fifteen credit hours selected from the courses in the department, i.e. those with MTLE designation.


Graduate Programs

Master of Science   Twenty-four credits of course work are required, with at least 18 credits in materials courses. Three credits each are required in the areas of thermodynamics and kinetics, structure, and mechanical properties. Students who have not taken courses equivalent to undergraduate work at Rensselaer in X-ray diffraction, thermodynamics, mechanical properties, and their area of specialization must take graduate courses in these areas. Six credits of research work leading to an M.S. thesis are also required.

Master of Engineering   Thirty credits of course work beyond the bachelor’s degree are required, with at least 21 credits in materials courses. These must include one course each in the structure and defects, thermodynamics and kinetics, and mechanical properties areas. A capstone independent study project is also required.

Doctor of Philosophy in Materials Engineering   A minimum of 45 credits in course work is required. In addition to the course requirements for the Master of Science degree, a minor of nine credits in a subject area outside the materials department is required. The student must pass an oral preliminary examination and an oral candidacy examination, as well as the final examination on the Ph.D. thesis.

Area course requirements may be satisfied by taking one course from each of the following three groups:

Structure and Defects
MTLE-6010 Defects in Solids
MTLE-6040 Principles of Crystallography and X-ray Diffraction
MTLE-6080 Electron Microscopy of Materials

Mechanical Properties
MTLE-6150 Fracture of Solids
MTLE-6610 Deformation Processing
MTLE-6830 Deformation of Materials and Rheology

Thermodynamics and Kinetics
MTLE-6030 Advanced Thermodynamics
MTLE-6060 Kinetics of Materials Reactions
MTLE-6110 Diffusion in Solids

Courses   Courses in Materials Science and Engineering are listed in this catalog under the department letters MTLE.

 

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