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Features: April 1, 2002
Rensselaer Awarded Microelectronics Center
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David Duquette (left) and
Toh-Ming Lu |
Rensselaer has been awarded a Center for
Advanced Interconnect Systems Technologies (CAIST) by the
Semiconductor Research Corporation (SRC) to support research
in microelectronic interconnect technologies, the backbone
of the next generation of computer technology. The new center
will continue and advance the work of the Center for Advanced
Interconnect Science and Technology created in 1996.
The three-year program is valued at more
than $9 million, which includes $500,000 per year from New
York state. The SRC will provide $1.5 million per year,
and IBM will provide a minimum of $1 million per year in
cash, scholarships, and equipment. Rensselaer will provide
$250,000 per year in administrative costs and technical
support.
Toh-Ming Lu, the Ray Palmer Baker
Distinguished Professor at Rensselaer, will direct the
CAIST. David Duquette, chair of materials science and
engineering at Rensselaer, and Paul Ho, director of
the Laboratory for Interconnect and Packaging at the
University of Texas-Austin, will serve as associate
directors.
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Toh-Ming Lu, the Ray Palmer Baker Distinguished
Professor at Rensselaer, will direct the CAIST. David Duquette,
chair of materials science and engineering at Rensselaer,
and Paul Ho, director of the Laboratory for Interconnect
and Packaging at the University of Texas-Austin, will serve
as associate directors.
The CAIST will draw on the expertise of
New York researchers from Rensselaer, Columbia, Rochester,
Cornell, and the University at Albany. It will combine that
expertise with that of researchers from Georgia Institute
of Technology, University of Texas-Austin, MIT, UC Berkeley,
University of Maryland, North Texas University, and Texas
Tech.
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